MPX10GS Freescale Semiconductor, MPX10GS Datasheet - Page 4

PRESSURE SENSOR GAUGE 4-SIP

MPX10GS

Manufacturer Part Number
MPX10GS
Description
PRESSURE SENSOR GAUGE 4-SIP
Manufacturer
Freescale Semiconductor
Series
MPX10r
Datasheet

Specifications of MPX10GS

Pressure Type
Gauge
Operating Pressure
1.45 PSI
Output
0 ~ 35mV
Voltage - Supply
3V
Termination Style
PCB
Operating Temperature
-40°C ~ 125°C
Package / Case
4-SIP, Axial Port
Mounting Style
Through Hole
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Operating Supply Voltage
3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
MPX10
4
Temperature Compensation
MPX10 series over temperature.
diaphragm, there are no temperature effects due to
differences in the thermal expansion of the strain gauge and
the diaphragm, as are often encountered in bonded strain
gauge pressure sensors. However, the properties of the
strain gauge itself are temperature dependent, requiring that
the device be temperature compensated if it is to be used
over an extensive temperature range.
achieved rather simply with additional resistive components,
or by designing your system using the MPX2010D series
sensor.
the equation: V
pressure range
calculating nonlinearity: 1) end point straight line fit or 2) a
least squares best line fit. While a least squares fit gives the
Figure 2
Because this strain gauge is an integral part of the silicon
Temperature compensation and offset calibration can be
Linearity refers to how well a transducer’s output follows
Pressure
70
60
50
40
30
20
10
Figure 3. Linearity Specification Comparison
0
0
shows the typical output characteristics of the
out
(Figure
Actual
= V
off
3). There are two basic methods for
LINEARITY
+ sensitivity x P over the operating
Pressure (kPa)
Linearity
Theoretical
PSI
kPa
80
70
60
50
40
30
20
10
0
0
V
Figure 2. Output vs. Pressure Differential
S
P1 > P2
MPX10
= 3 V
2.0
0.3
DC
Max
(V
(V
Offset
Span
OFF
FSS
P
)
)
OP
Pressure Differential
4.0
0.6
-40°C
Lead Frame
6.0
0.9
“best case” linearity error (lower numerical value), the
calculations required are burdensome.
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user.
Freescale’s specified pressure sensor linearities are based
on the end point straight line method measured at the
midrange pressure.
in the basic chip carrier (Case 344). A silicone gel isolates the
die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the silicon
diaphragm.
characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your
application.Refer to application note AN3728, for more
information regarding media compatibility.
Figure 4. Unibody Package — Cross-Sectional Diagram
Wire Bond
Conversely, an end point fit will give the “worst case” error
Figure 4
The MPX10 series pressure sensor operating
+25°C
8.0
1.2
illustrates the differential or gauge configuration
+125°C
Die Coat
Silicone
10
1.5
(Not to Scale)
Range
Offset
Span
(Typ)
(Typ)
Die
P1
P2
Freescale Semiconductor
Stainless Steel
Metal Cover
Sensors
RTV Die
Bond
Epoxy
Case

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