MP3V7007GP Freescale Semiconductor, MP3V7007GP Datasheet - Page 6

IC PRESSURE SENSOR 8-SOP

MP3V7007GP

Manufacturer Part Number
MP3V7007GP
Description
IC PRESSURE SENSOR 8-SOP
Manufacturer
Freescale Semiconductor
Series
MP3V7007r
Datasheet

Specifications of MP3V7007GP

Pressure Type
Gauge
Operating Pressure
±1 PSI
Port Size
Male, 0.12" (3mm) OD
Output
0.5 ~ 4.5 V Ratiometric
Voltage - Supply
4.75 V ~ 5.25 V
Termination Style
PCB
Operating Temperature
-40°C ~ 125°C
Package / Case
8-SOP Side Port
Accuracy
5 %
Mounting Style
SMD/SMT
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Operating Supply Voltage
3 V
Supply Voltage (min)
2.7 V
Supply Voltage (max)
3.3 V
Supply Current
7 mA
Output Voltage
0.2 V to 2.8 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MP3V7007GP
Manufacturer:
FREESCALE
Quantity:
20 000
MP3V7007
6
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluoro silicone gel
which protects the die from harsh media. The pressure
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
MP3V7007GC6U/C6T1
MP3V7007GP
MP3V7007DP
Freescale designates the two sides of the pressure sensor
Surface mount board layout is a critical portion of the total
Pressure
Pressure
Pressure Error Band
Error
(kPa)
–0.1
–0.2
–0.3
–0.4
–0.5
0.5
0.4
0.3
0.2
0.1
0
Part Number
-7
0.060 TYP 8X
1.52
Figure 5. Small Outline Package Footprint
0.100 TYP 8X
2.54
Case Type
0.660
16.76
0
482A
1369
1351
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
following table:
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
The Pressure (P1) side may be identified by using the
inch
mm
Side with Port Attached
Side with Part Marking
Side with Port Attached
SCALE 2:1
0.100 TYP 8X
2.54
0.300
7.62
- 7 to 7 (kPa)
Pressure
+7
Side Identifier
Pressure (P1)
Freescale Semiconductor
Pressure (kPa)
Error (Max)
±0.5 (kPa)
Sensors

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