MPXH6300AC6T1 Freescale Semiconductor, MPXH6300AC6T1 Datasheet - Page 4

SENSOR PRESSURE 20-304KPA 1317A

MPXH6300AC6T1

Manufacturer Part Number
MPXH6300AC6T1
Description
SENSOR PRESSURE 20-304KPA 1317A
Manufacturer
Freescale Semiconductor
Series
MPXH6300r
Datasheet

Specifications of MPXH6300AC6T1

Pressure Type
Absolute
Operating Pressure
3 ~ 42 PSI
Output
0 ~ 4.9V
Voltage - Supply
4.85 V ~ 5.35 V
Termination Style
PCB
Operating Temperature
-40°C ~ 125°C
Package / Case
8-SSOP with Port
Mounting Style
SMD/SMT
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Operating Supply Voltage
5.1 V
Output Voltage
4.847 V to 4.977 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
Q1710062

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPXH6300AC6T1
Manufacturer:
FREESCALE
Quantity:
5 000
Part Number:
MPXH6300AC6T1
0
MPXH6300A
4
On-chip Temperature Compensation and Calibration
Super Small Outline chip carrier (Case 1317).
illustrates a typical application circuit (output source current
operation).
pressure input. Typical minimum and maximum output
curves are shown for operation over 0 to 85°C temperature
range. The output will saturate outside of the rated pressure
range.
Figure 2. Cross Sectional Diagram SSOP (not to scale)
Figure 2
Figure 4
Pressure
Sealed Vacuum Reference
Fluoro Silicone
Wire Bond
Frame
Gel Die Coat
Lead
illustrates the absolute sensing chip in the basic
shows the sensor output signal relative to
Absolute Element
P1
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
Die
Transfer Function:
V
V
Temperature = 0 to 85°C
Figure 4. Output vs. Absolute Pressure
out
S
= 5.1 Vdc
= V
Figure 3
s
Die Bond
*(.00318*P-.00353) ± Error
Pressure (Reference to Sealed Vacuum) in kPa
Thermoplastic
Steel Cap
Stainless
MAX
Case
MIN
100 nF
from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The MPXH6300A
series pressure sensor operating characteristics, internal
reliability and qualification tests are based on use of dry air as
the pressure media. Media other than dry air may have
adverse effects on sensor performance and long-term
reliability. Contact the factory for information regarding media
compatibility in your application.
A fluorosilicone gel isolates the die surface and wire bonds
TYP
+5.1 V
Figure 3. Typical Application Circuit
(Output Source Current Operation)
V
GND Pin 3
S
MPXH6300A
Pin 2
V
out
Pin 4
Freescale Semiconductor
47 pF
51 K
Sensors
to ADC

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