MPXV5004DP Freescale Semiconductor, MPXV5004DP Datasheet - Page 4

• Manufacturer Part Number: MPXV5004DP
• Description: SENSOR PRESSURE SMD 8-SOP
• Manufacturer: Freescale Semiconductor
• Series: MPXV5004r

Specifications of MPXV5004DP

• Pressure Type: Differential
• Operating Pressure: 0.57 PSI, 3.92 kPa
• Port Size: Male, 0.13" (3.302mm) Tube, Dual
• Output: 0 ~ 4.9V
• Voltage - Supply: 4.75 V ~ 5.25 V
• Termination Style: PCB
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 8-SOP Dual Port
• Accuracy: 1.5 %
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: 0 C
• Operating Supply Voltage: 5 V
• Supply Voltage (min): 4.75 V
• Supply Voltage (max): 5.25 V
• Supply Current: 10 mA
• Output Voltage: 4.9 V
• Shutdown: No
• Operating Pressure Range: 0 To 3.92kPa
• Connection Size: 3.302mm
• Sensitivity, V/p: 1V/kPa
• Sensor Case Style: SOP
• No. Of Pins: 8
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MPXV5004G
4
Maximum Ratings
Table 2. Maximum Ratings
On-chip Temperature Compensation and Calibration
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
chip carrier (Case 482). A fluorosilicone gel isolates the die
surface and wire bonds from the environment, while allowing
the pressure signal to be transmitted to the silicon diaphragm.
are based on use of dry air as pressure media. Media, other
than dry air, may have adverse effects on sensor
performance and long-term reliability. Internal reliability and
Maximum Pressure (P1 > P2)
Storage Temperature
Operating Temperature
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1
The performance over temperature is achieved by
Figure 2
The MPxx5004G series sensor operating characteristics
Pressure
shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
illustrates the gauge configuration in the basic
Rating
(1)
Lead Frame
Sensing
Element
Wire Bond
Figure 2. Cross-Sectional Diagram (Not to Scale)
Figure 1. Integrated Pressure Sensor Schematic
Differential Sensing Element
Fluorosilicone
GND
Gel Die Coat
3
and Calibration
Compensation
Temperature
Thin Film
Circuitry
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
for small outline package device.
V
S
2
P1
P2
qualification test for dry air, and other media, are available
from the factory. Contact the factory for information regarding
media tolerance in your application.
interfacing the output of the MPxx5004G to the A/D input of
the microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
for operation over a temperature range of 10°C to 60°C using
the decoupling circuit shown in
saturate outside of the specified pressure range.
Die
Symbol
Figure 3
Typical, minimum and maximum output curves are shown
P
T
T
MAX
STG
Gain Stage #2
Shift Circuitry
A
Reference
Ground
and
shows the recommended decoupling circuit for
Steel Cap
Stainless
Die Bond
Thermoplastic
Case
4
–30 to +100
0 to +85
V
Value
OUT
16
Figure
Freescale Semiconductor
3. The output will
Unit
kPa
°C
°C
Sensors