MPXV7002DP Freescale Semiconductor, MPXV7002DP Datasheet - Page 5
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MPXV7002DP
Manufacturer Part Number
MPXV7002DP
Description
PRESSURE SENSOR DUAL PORT 8-SOP
Manufacturer
Freescale Semiconductor
Series
MPXV7002r
Datasheet
1.MPXV7002DP.pdf
(11 pages)
Specifications of MPXV7002DP
Pressure Type
Differential
Operating Pressure
±0.3 PSI
Port Size
Male, 0.13" (3.302mm) Tube, Dual
Output
0 ~ 4.5V
Voltage - Supply
4.75 V ~ 5.25 V
Termination Style
PCB
Operating Temperature
10°C ~ 60°C
Package / Case
8-SOP Dual Port
Accuracy
2.5 %
Mounting Style
SMD/SMT
Maximum Operating Temperature
+ 60 C
Minimum Operating Temperature
+ 10 C
Operating Supply Voltage
5 V
Supply Voltage (min)
4.75 V
Supply Voltage (max)
5.25 V
Supply Current
10 mA
Output Voltage
4.5 V
Shutdown
No
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPXV7002DP
Manufacturer:
FREESCALE
Quantity:
2 000
Sensors
Freescale Semiconductor
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing a gel die coat which
protects the die from harsh media.
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
MPXV7002GC6U/GC6T1
MPXV7002GP
MPXV7002DP
Freescale designates the two sides of the pressure sensor
Surface mount board layout is a critical portion of the total
Part Number
0.060 TYP 8X
1.52
5.0
4.0
3.0
2.0
1.0
0
-2
Figure 4. Output versus Pressure Differential
Figure 5. Small Outline Package Footprint
Transfer Function:
V
V
T
out
S
A
= 10 to 60°C
= 5.0 Vdc
= V
MAX
S
× (0.2 × P(kPa)+0.5) ± 6.25% V
-1
Differential Pressure (kPa)
0.100 TYP 8X
2.54
Case Type
0.660
16.76
482A-01
1369-01
1351-01
0
following table:
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
MIN
The Pressure (P1) side may be identified by using the
FSS
inch
mm
1
Side with Port Attached
Side with Port Attached
Side with Part Marking
TYPICAL
SCALE 2:1
0.100 TYP 8X
2.54
0.300
7.62
2
Side Identifier
Pressure (P1)
Pressure
MPXV7002
5