TXM-900-HP-II Linx Technologies Inc, TXM-900-HP-II Datasheet - Page 3

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TXM-900-HP-II

Manufacturer Part Number
TXM-900-HP-II
Description
TRANSMITTER RF 900MHZ 8-CHANNEL
Manufacturer
Linx Technologies Inc
Series
HP2r
Datasheet

Specifications of TXM-900-HP-II

Frequency
902MHz ~ 928MHz
Applications
ISM, RKE, Security and Fire Alarms
Modulation Or Protocol
FM, FSK
Data Rate - Maximum
50 kbps
Power - Output
-3dBm ~ 4dBm
Data Interface
PCB, Through Hole
Antenna Connector
Through Hole
Voltage - Supply
2.17 V ~ 16 V
Operating Temperature
0°C ~ 70°C
Package / Case
SIP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Memory Size
-
Current - Transmitting
-
Other names
TXM-900-HP2
TXM-900-HP2
TYPICAL PERFORMANCE GRAPHS
PHYSICAL PACKAGING
PRODUCTION CONSIDERATIONS
Wave Input
Figure 8: Modulation Linearity for Triangle
Figure 6: Modulation Linearity for Square
Wave Input
Figure 4: Power-On Timing
The transmitter is packaged as a hybrid through-
hole SIP-style module with 10 pins spaced at .1"
i n t e rvals with a .3" gap between pins 2 & 3.
Baseband components occupy the rear of the board
while high-frequency components are grouped on
the front.
The SIP module may be installed using hand- or wave-solder techniques . The
module should not be subjected to reflow. If the module is subject to production
wash cycles, adequate drying time should be allowed prior to power-up. If the
wash cycle introduces contaminants, the module’s perfo rmance may be
adversely affected.
1.00 V/div
10.0 ms/div
1.00 V/div
0.0 s
120 mV
+/-1.0 V
Figure 5: Channel Change Timing
Figure 7: Modulation Linearity for Sine
Wave Input
Figure 9: Output Power vs. Supply Voltage
2.00 V/div
500 µs/div
1.00 V/div
Figure 10: Physical package
0.0 s
1.67 V
+/-1.0 V
Page 3

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