SI4713-B30-GMR Silicon Laboratories Inc, SI4713-B30-GMR Datasheet - Page 38
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SI4713-B30-GMR
Manufacturer Part Number
SI4713-B30-GMR
Description
IC TX FM RADIO RPS/RDS 20UQFN
Manufacturer
Silicon Laboratories Inc
Datasheet
1.SI4712-B30-GMR.pdf
(42 pages)
Specifications of SI4713-B30-GMR
Frequency
76MHz ~ 108MHz
Applications
General Purpose
Modulation Or Protocol
FM
Current - Transmitting
18.8mA
Data Interface
PCB, Surface Mount
Antenna Connector
PCB, Surface Mount
Voltage - Supply
2.7 V ~ 5.5 V
Package / Case
20-UQFN, 20-µQFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Power - Output
-
Operating Temperature
-
Memory Size
-
Data Rate - Maximum
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SI4713-B30-GMR
Manufacturer:
SiliconL
Quantity:
2 500
Si4712/13-B30
38
Notes: General
Note: Solder Mask Design
Notes: Stencil Design
Notes: Card Assembly
Symbol
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and tolerancing is per the ANSI Y14.5M-1994 specification.
3. This land pattern design is based on IPC-SM-782 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material
1. All metal pads are to be non-solder-mask-defined (NSMD). Clearance between the
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads.
4. A 1.45 x 1.45 mm square aperture should be used for the center pad. This provides
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C
GD
D2
E2
D
E
e
f
Condition (LMC) is calculated based on a fabrication allowance of 0.05 mm.
solder mask and the metal pad is to be 60 mm minimum, all the way around the pad.
be used to assure good solder paste release.
approximately 70% solder paste coverage on the pad, which is optimum to assure
correct component standoff.
specification for small body components.
1.60
1.60
2.10
Min
Table 20. PCB Land Pattern Dimensions
Millimeters
2.71 REF
0.50 BSC
2.71 REF
2.53 BSC
Max
1.80
1.80
—
Rev. 1.1
Symbol
GE
ZD
ZE
W
X
Y
2.10
Min
—
—
—
—
Millimeters
0.61 REF
Max
0.34
0.28
3.31
3.31
—