ATMEGA128RFA1-ZU Atmel, ATMEGA128RFA1-ZU Datasheet - Page 2

IC AVR MCU 2.4GHZ XCEIVER 64QFN

ATMEGA128RFA1-ZU

Manufacturer Part Number
ATMEGA128RFA1-ZU
Description
IC AVR MCU 2.4GHZ XCEIVER 64QFN
Manufacturer
Atmel
Series
ATMEGAr

Specifications of ATMEGA128RFA1-ZU

Frequency
2.4GHz
Data Rate - Maximum
2Mbps
Modulation Or Protocol
802.15.4 Zigbee
Applications
General Purpose
Power - Output
3.5dBm
Sensitivity
-100dBm
Voltage - Supply
1.8 V ~ 3.6 V
Current - Receiving
12.5mA
Current - Transmitting
14.5mA
Data Interface
PCB, Surface Mount
Memory Size
128kB Flash, 4kB EEPROM, 16kB RAM
Antenna Connector
PCB, Surface Mount
Operating Temperature
-40°C ~ 85°C
Package / Case
64-VFQFN, Exposed Pad
Rf Ic Case Style
QFN
No. Of Pins
64
Supply Voltage Range
1.8V To 3.6V
Operating Temperature Range
-40°C To +85°C
Svhc
No SVHC (15-Dec-2010)
Rohs Compliant
Yes
Processor Series
ATMEGA128x
Core
AVR8
Data Bus Width
8 bit
Program Memory Type
Flash
Program Memory Size
128 KB
Data Ram Size
16 KB
Interface Type
JTAG
Maximum Clock Frequency
16 MHz
Number Of Programmable I/os
38
Number Of Timers
6
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWAVR, EWAVR-BL
Development Tools By Supplier
ATAVR128RFA1-EK1
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ATMEGA128RFA1-ZU
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
Part Number:
ATMEGA128RFA1-ZUR
Manufacturer:
ON
Quantity:
56 000
1 Pin Configurations
2 Disclaimer
2
ATmega128RFA1
[PF2:ADC2:DIG2]
[PF3:ADC3:DIG4]
[PF5:ADC5:TMS]
[PF6:ADC6:TDO]
[PF4:ADC4:TCK]
[PF7:ADC7:TDI]
[AVSS_RFN]
[AVSS_RFP]
[PG0:DIG3]
[PG1:DIG1]
[PG2:AMR]
[RSTON]
[RSTN]
[RFP]
[RFN]
[TST]
Figure 1-1. Pinout ATmega128RFA1
Note:
Typical values contained in this datasheet are based on simulation and characterization
results of other AVR microcontrollers and radio transceivers manufactured in a similar
process technology. Minimum and Maximum values will be available after the device is
characterized.
12
13
14
15
16
10
11
1
2
3
4
5
6
7
8
9
The large center pad underneath the QFN/MLF package is made of metal and internally connected
to AVSS. It should be soldered or glued to the board to ensure good mechanical stability. If the
center pad is left unconnected, the package might loosen from the board
17 18 19 20 21
64 63
Exposed paddle: [AVSS]
62 61 60 59 58 57
Index corner
22
ATmega128RFA1
23
24 25 26 27
56 55 54 53 52 51
0
28
29
0
30
50 49
31 32
47
46
45
42
41
40
39
38
37
36
35
34
33
48
44
43
[PE2:XCK0:AIN0]
[PE1:TXD0]
[PE0:RXD0:PCINT8]
[DVSS]
[DEVDD]
[PB7:OC0A:OC1C:PCINT7]
[PB6:OC1B:PCINT6]
[PB5:OC1A:PCINT5]
[PB4:OC2A:PCINT4]
[PB3:MISO:PDO:PCINT3]
[PB2:MOSI:PDI:PCINT2]
[PB1:SCK:PCINT1]
[PB0:SSN:PCINT0]
[DVSS]
[DEVDD]
[CLKI]
8266BS-MCU Wireless-03/11

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