JN5148-001-M00T NXP Semiconductors, JN5148-001-M00T Datasheet - Page 14

MODULE ZIGBEE PRO CERM ANTENNA

JN5148-001-M00T

Manufacturer Part Number
JN5148-001-M00T
Description
MODULE ZIGBEE PRO CERM ANTENNA
Manufacturer
NXP Semiconductors
Series
JN5148r
Datasheets

Specifications of JN5148-001-M00T

Frequency
2.4GHz
Modulation Or Protocol
802.15.4 Zigbee
Applications
AMR, ISM, Home Automation, Process Control
Power - Output
2.5dBm
Sensitivity
-95dBm
Voltage - Supply
2.3 V ~ 3.6 V
Current - Receiving
17.5mA
Current - Transmitting
15mA
Data Interface
PCB, Surface Mount
Memory Size
4Mbit Flash, 128kB RAM, 128kB ROM
Antenna Connector
On-Board, Chip
Operating Temperature
-40°C ~ 85°C
Package / Case
Module
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Data Rate - Maximum
-
Other names
616-1045-2
935294034534
JN5148-001-M00T
A.3 Manufacturing
A.3.1 Reflow Profile
For reflow soldering, it is recommended to follow the reflow profile in figure 6 as a guide, as well as the paste
manufacturers guidelines on peak flow temperature, soak times, time above liquidus and ramp rates.
A.3.2 Soldering Paste and Cleaning
Jennic would not recommend use of a solder paste that requires the module and pcb assembly to be cleaned (rinsed
in water) for the following reasons:
Solder flux residues and water can be trapped by the pcb, can or components and result in short circuits.
The module label could be damaged or removed.
Jennic recommends use of a 'no clean' solder paste for all its module products.
14
Temperature
Target Time (s)
25~160 ºC
90~130
Figure 6: Recommended solder reflow profile
JN-DS-JN5148-001-Myy 1v4
160~190 ºC
30~60
> 220º C
20~50
230~Pk.
10~15
© NXP Laboratories UK 2010
Pk. Temp
150~270
(235ºC)

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