UPB1009K-E1-A CEL, UPB1009K-E1-A Datasheet - Page 27

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UPB1009K-E1-A

Manufacturer Part Number
UPB1009K-E1-A
Description
IC GPS RECEIVER LP 36-QFN
Manufacturer
CEL
Datasheet

Specifications of UPB1009K-E1-A

Frequency
1.575GHz
Modulation Or Protocol
GPS
Applications
GPS Receiver
Current - Receiving
26mA
Data Interface
PCB, Surface Mount
Antenna Connector
PCB, Surface Mount
Voltage - Supply
2.7 V ~ 3.3 V
Operating Temperature
-40°C ~ 85°C
Package / Case
36-QFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Sensitivity
-
Memory Size
-
Data Rate - Maximum
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPB1009K-E1-A
Manufacturer:
ST
Quantity:
2 150
Part Number:
UPB1009K-E1-A
Manufacturer:
NEC
Quantity:
20 000
NOTES
RECOMMENDED
conditions other than those recommended below, contact your nearby sales office.
Infrared Reflow
VPS
Wave Soldering
Partial Heating
Caution Do not use different soldering methods together (except for partial heating).
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent abnormal oscillation).
(3) Keep the wiring length of the ground pins as short as possible.
(4) Connect a bypass capacitor to the V
(5) High-frequency signal I/O pins must be coupled with the external circuit using a coupling capacitor.
This product should be soldered and mounted under the following recommended conditions. For soldering methods and
Soldering Method
ON
CORRECT
SOLDERING
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (package surface temperature)
Time at temperature of 200°C or higher
Preheating time at 120 to 150°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature)
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (pin temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
USE
CC
CONDITIONS
pin.
Soldering Conditions
: 260°C or below
: 10 seconds or less
: 60 seconds or less
: 120±30 seconds
: 3 times
: 0.2%(Wt.) or below
: 215°C or below
: 25 to 40 seconds
: 30 to 60 seconds
: 3 times
: 0.2%(Wt.) or below
: 260°C or below
: 10 seconds or less
: 120°C or below
: 1 time
: 0.2%(Wt.) or below
: 350°C or below
: 3 seconds or less
: 0.2%(Wt.) or below
Condition Symbol
WS260
HS350
UPB1009K
VP215
IR260
2 7

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