MPC8377EWLANB Freescale Semiconductor, MPC8377EWLANB Datasheet - Page 89
MPC8377EWLANB
Manufacturer Part Number
MPC8377EWLANB
Description
ACCESS POINT/ROUTER MPC8377
Manufacturer
Freescale Semiconductor
Datasheet
1.MPC8377EVRAGD.pdf
(126 pages)
Specifications of MPC8377EWLANB
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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Figure 63
Note:
1
2
3
4
5
Freescale Semiconductor
All dimensions are in millimeters.
Dimensioning and tolerancing per ASME Y14. 5M-1994.
Maximum solder ball diameter measured parallel to Datum A.
Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
Parallelism measurement should exclude any effect of mark on top surface of package.
Figure 63. Mechanical Dimensions and Bottom Surface Nomenclature of the TEPBGA II
shows the mechanical dimensions and bottom surface nomenclature of the TEPBGA II package.
MPC8377E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4
Package and Pin Listings
89
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