MW7IC3825GNR1 Freescale Semiconductor, MW7IC3825GNR1 Datasheet - Page 3

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MW7IC3825GNR1

Manufacturer Part Number
MW7IC3825GNR1
Description
IC PWR AMP RF 3500MHZ TO-270-16
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MW7IC3825GNR1

Current - Supply
230mA
Frequency
3.4GHz ~ 3.6GHz
Gain
25dB
P1db
30W
Package / Case
TO-270-16
Rf Type
WiMax
Test Frequency
3.6GHz
Voltage - Supply
32V
Drain Source Voltage (max)
65V
Output Power (max)
5W
Power Gain (typ)@vds
25dB
Frequency (min)
3.4GHz
Frequency (max)
3.6GHz
Package Type
TO-270 WB EP
Pin Count
16
Output Capacitance (typ)@vds
72.3@28VpF
Operating Temp Range
-65C to 225C
Drain Efficiency (typ)
15%
Mounting
Surface Mount
Mode Of Operation
OFDM/WIMAX
Vswr (max)
5
Screening Level
Military
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Noise Figure
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MW7IC3825GNR1
Manufacturer:
FREESCALE
Quantity:
1 400
Part Number:
MW7IC3825GNR1
Manufacturer:
FREESCALE
Quantity:
20 000
RF Device Data
Freescale Semiconductor
Table 5. Electrical Characteristics
Stage 2 - - Off Characteristics
Stage 2 - - On Characteristics
Stage 2 - - Dynamic Characteristics
Functional Tests
f = 3600 MHz, WiMAX, OFDM 802.16d, 64 QAM
on CCDF. ACPR measured in 1 MHz Channel Bandwidth @ ±8.5 MHz Offset.
Typical Performances OFDM Signal - - 10 MHz Channel Bandwidth (In Freescale Test Fixture, 50 ohm system) V
130 mA, I
Bandwidth, Input Signal PAR = 9.5 dB @ 0.01% Probability on CCDF.
Zero Gate Voltage Drain Leakage Current
Zero Gate Voltage Drain Leakage Current
Gate--Source Leakage Current
Gate Threshold Voltage
Gate Quiescent Voltage
Fixture Gate Quiescent Voltage
Drain--Source On--Voltage
Output Capacitance
Power Gain
Power Added Efficiency
Output Peak--to--Average Ratio @ 0.01% Probability on CCDF
Adjacent Channel Power Ratio
Input Return Loss
Relative Constellation Error
Error Vector Magnitude
1. V
2. Part internally matched both on input and output.
3. Measurement made with device in straight lead configuration before any lead forming operation is applied.
4. RCE = 20Log(EVM/100).
(V
(V
(V
(V
(V
(V
(V
(V
schematic.
DS
DS
GS
DS
DS
DD
GS
DS
GG
= 65 Vdc, V
= 28 Vdc, V
= 1.5 Vdc, V
= 10 Vdc, I
= 28 Vdc, I
= 28 Vdc, I
= 10 Vdc, I
= 28 Vdc ± 30 mV(rms)ac @ 1 MHz, V
DQ2
= 1.22 x V
= 230 mA, P
(3)
D
DQ2
DQ2
D
GS(Q)
(In Freescale Test Fixture, 50 ohm system) V
GS
GS
DS
= 120 μAdc)
= 1 Adc)
= 0 Vdc)
= 0 Vdc)
= 230 mA)
= 230 mA, Measured in Functional Test)
= 0 Vdc)
(4)
. Parameter measured on Freescale Test Fixture, due to resistive divider network on the board. Refer to Test Circuit
out
= 5 W Avg., f = 3400 MHz and f = 3600 MHz, WiMAX, OFDM 802.16d, 64 QAM
(4)
Characteristic
(1)
(2)
(T
A
= 25°C unless otherwise noted)
GS
3
/
4
= 0 Vdc)
, 4 Bursts, 10 MHz Channel Bandwidth, Input Signal PAR = 9.5 dB @ 0.01% Probability
DD
= 28 Vdc, I
(continued)
Symbol
V
V
V
V
MW7IC3825NR1 MW7IC3825GNR1 MW7IC3825NBR1
ACPR
RCE
EVM
I
I
I
DS(on)
C
DQ1
PAE
PAR
GG(Q)
GS(th)
GS(Q)
G
GSS
IRL
DSS
DSS
oss
ps
= 130 mA, I
Min
1.2
2.5
0.2
7.5
21
12
DQ2
= 230 mA, P
72.3
Typ
--48
--12
--33
2.7
3.3
0.5
8.5
2.2
25
15
2
3
/
4
, 4 Bursts, 10 MHz Channel
out
DD
= 5 W Avg.,
= 28 Vdc, I
Max
--45
2.7
1.2
10
32
--6
1
1
4
(continued)
DQ1
% rms
μAdc
μAdc
μAdc
Unit
Vdc
Vdc
Vdc
Vdc
dBc
pF
dB
dB
dB
dB
=
%
3

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