ACPM-7357-TR1 Avago Technologies US Inc., ACPM-7357-TR1 Datasheet - Page 12

• Manufacturer Part Number: ACPM-7357-TR1
• Description: IC PA MOD UMTS BAND1/8 14-SMD
• Manufacturer: Avago Technologies US Inc.
• Type: Power Amplifierr

Specifications of ACPM-7357-TR1

• Package / Case: 14-SMD Module
• Current - Supply: 400mA
• Frequency: 890MHz ~ 915MHz, 1.92GHz ~ 1.98GHz
• Gain: 27.3dB
• Rf Type: UMTS
• Test Frequency: 1.92GHz ~ 1.98GHz
• Voltage - Supply: 3.2V ~ 4.2V
• Operating Frequency: 1980 MHz
• Supply Current: 450 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 30 C
• Number Of Channels: 2 Channels
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Noise Figure: -
• P1db: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Contains lead / RoHS non-compliant

0.40
0.50
0.73
0.40
0.73
Metallization
Solder Mask Opening
Solder Paste Stencil Aperture
12
0.73
0.70
0.60
0.25
0.60
2.40
2.00
0.55
0.50
0.50
ø 0.3 Via
on 0.6 pitch
2.30
2.10
0.33
PCB Design Guidelines
The recommended PCB land pattern is shown in figures
on the left side. The substrate is coated with solder mask
between the I/O and conductive paddle to protect the
gold pads from short circuit that is caused by solder
bleeding/bridging.
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads.
The recommended stencil layout is shown here. Reducing
the stencil opening can potentially generate more voids.
On the other hand, stencil openings larger than 100% will
lead to excessive solder paste smear or bridging across
the I/O pads or conductive paddle to adjacent I/O pads.
Considering the fact that solder paste thickness will
directly affect the quality of the solder joint, a good choice
is to use laser cut stencil composed of 0.100mm(4mils) or
0.127mm(5mils) thick stainless steel which is capable of
producing the required fine stencil outline.