AMMP-5618-BLK Avago Technologies US Inc., AMMP-5618-BLK Datasheet - Page 8

• Manufacturer Part Number: AMMP-5618-BLK
• Description: IC AMP GP HI PWR 6-20GHZ 8-SMD
• Manufacturer: Avago Technologies US Inc.
• Type: General Purpose Amplifierr

Specifications of AMMP-5618-BLK

• Gain: 13dB
• Current - Supply: 107mA
• Frequency: 6GHz ~ 20GHz
• Noise Figure: 4.4dB
• P1db: 19dBm
• Package / Case: 8-QFN
• Rf Type: DBS, LMDS, VSAT
• Voltage - Supply: 3 V ~ 5 V
• Frequency Range: 6GHz To 20GHz
• Noise Figure Typ: 4.4dB
• Supply Current: 107mA
• Supply Voltage Range: 5V
• Rf Ic Case Style: SMD
• No. Of Pins: 8
• Package: 8SMD
• Number Of Channels Per Chip: 1
• Typical Output Power: 19 dBm
• Typical Power Gain: 13 dB
• Maximum Operating Frequency Range: >=20000 MHz
• Maximum Output Return Loss: 12(Typ) dB
• Typical Noise Figure: 4.4 dB
• Typical Output Intercept Point: 30 dBm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Test Frequency: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1852; AMMP-5618-BLK

Solder Reflow Profile
The most commonly used solder reflow method is ac-
complished in a belt furnace using convection heat
transfer. The suggested reflow profile for automated
reflow processes is shown in Figure 24. This profile is
designed to ensure reliable finished joints. However, the
profile indicated in Figure 1 will vary among different
solder pastes from different manufacturers and is shown
here for reference only.
Figure 24. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste.
8
300
250
200
150
100
50
0
0
Ramp 1
50
Preheat
Peak = 250 ±5°C
100
Ramp 2
Seconds
150
Reflow
Melting point = 218°C
200
Cooling
250
300
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure 25. The stencil has a solder paste deposi-
tion opening approximately 70% to 90% of the PCB pad.
Reducing stencil opening can potentially generate more
voids underneath. On the other hand, stencil openings
larger than 100% will lead to excessive solder paste smear
or bridging across the I/O pads. Considering the fact that
solder paste thickness will directly affect the quality of
the solder joint, a good choice is to use a laser cut stencil
composed of 0.127 mm (5 mils) thick stainless steel which
is capable of producing the required fine stencil outline.
Figure 25. Stencil Outline Drawing (mm).
Figure 26. Combined PCB and Stencil Layouts (mm).
0.38
0.56
0.1
1.04
0.39
0.3
2.49
0.72
0.36