ISL55016IRTZ-T7 Intersil, ISL55016IRTZ-T7 Datasheet

IC AMP MMIC BIPOLAR DIFF 6-TDFN

ISL55016IRTZ-T7

Manufacturer Part Number
ISL55016IRTZ-T7
Description
IC AMP MMIC BIPOLAR DIFF 6-TDFN
Manufacturer
Intersil
Datasheet
1.ISL55016IRTZ-T7.pdf (11 pages)

Specifications of ISL55016IRTZ-T7

Current - Supply
104mA
Frequency
0Hz ~ 2GHz
Gain
17.5dB
Noise Figure
5.4dB
Package / Case
6-TDFN
Rf Type
Bluetooth
Voltage - Supply
4.5 V ~ 5.5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
P1db
-
Test Frequency
-
Other names
ISL55016IRTZ-T7TR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Bonase Electronics (HK) Co., Limited Bonase Electronics (HK) Co., Limited
Part Number:
ISL55016IRTZ-T7
Manufacturer:
HOSIDEN
Quantity:
3 500
Company:
Meier Automation Equipment Co., Limited Meier Automation Equipment Co., Limited
Part Number:
ISL55016IRTZ-T7
Manufacturer:
INTERSIL
Quantity:
20 000
Company:
H&T Electronics H&T Electronics
Part Number:
ISL55016IRTZ-T7
Quantity:
170
MMIC Silicon Bipolar Differential Amplifier
The ISL55016 is a high performance gain block which can
match a 75Ω single-ended source to a 100Ω differential
load. This feature makes the ISL55016 ideal for a wide
range of general-purpose applications such as Satellite TV.
The ISL55016 can be used as single-ended to differential
converter and eliminates the need for an external balun
structure.
Ordering Information
Pinout
Pin Descriptions
ISL55016IRTZ-T7* M9
*Please refer to TB347 for details on reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ
special Pb-free material sets, molding compounds/die attach
materials, and 100% matte tin plate plus anneal (e3 termination finish,
which is RoHS compliant and compatible with both SnPb and Pb-free
soldering operations). Intersil Pb-free products are MSL classified at
Pb-free peak reflow temperatures that meet or exceed the Pb-free
requirements of IPC/JEDEC J STD-020.
NUMBER
NUMBER
PIN
4, 5
1
2
3
6
(Note)
PART
VOP, VOM Differential outputs. VOP and VOM
NAME
VINM
VINP
VSM
VSP
PIN
VINM
MARKING
VINP
VSM
PART
1
2
3
(6 LD TDFN)
Ground
Single-Ended Input. VINM should be
AC-Coupled.
AC Ground
should be AC-Coupled. Differential
Impedance 100Ω.
Power supply. +5V
TOP VIEW
ISL55016
®
GND
-40 to +85 6 Ld TDFN L6.1.6x1.6B
1
RANGE
TEMP.
(°C)
DESCRIPTION
6
5
4
Data Sheet
VSP
VOM
VOP
PACKAGE
(Pb-Free)
DWG. #
PKG.
1-888-INTERSIL or 1-888-468-3774
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
Features
• Input Impedance of 75Ω Single-Ended
• Output Impedance of 100Ω Differential
• Noise Figure of 5.4dB
• OIP3 of 26dBm
• Input Return Loss of 27dB
• Pb-Free (RoHS Compliant)
Applications
• Active Balun Function
• LNB and LNB-T (HDTV) Amplifiers
• IF Gain Blocks for Satellite and Terrestrial STBs
• PA Driver Amplifier
• Wireless Data, Satellite
• Bluetooth/WiFi
• Satellite Locator and Signal Strength Meters
Typical Application Circuit
All other trademarks mentioned are the property of their respective owners.
June 24, 2008
|
100pF
0.1µF
Intersil (and design) is a registered trademark of Intersil Americas Inc.
100pF
Copyright © Intersil Americas Inc. 2008. All Rights Reserved.
100pF
2
3
+5V
1
6 5
4
100nH
27Ω
ISL55016
100nH
27Ω
100pF
100pF
FN6526.1

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ISL55016IRTZ-T7 Summary of contents

Page 1

... PART RANGE (Note) MARKING (°C) ISL55016IRTZ-T7* M9 - TDFN L6.1.6x1.6B *Please refer to TB347 for details on reel specifications. NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations) ...

Page 2

... Thermal Information Thermal Resistance (Typical, Note 1) + +0.3V to GND -0. TDFN Package Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +125°C Operating Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +135°C Pb-Free Reflow Profile .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp = 50Ω single-ended connected to VINM, Z RSC = +25°C, unless otherwise specified. A CONDITIONS 50MHz Z = 75Ω, Z ...

Page 3

Electrical Specifications VSP = +5V, Z VINP AC-grounded, T PARAMETER DESCRIPTION OIP3_diff Output Third Order Intercept Point, Differential OIP2_diff Output Second Order Intercept Point, Differential BW_diff 3dB Bandwidth, Differential NF_diff Noise Figure, Differential FREQ Frequency Range NOTE: 2. The numbers ...

Page 4

Typical Performance (I) Z RSC 0.5G 1.0G 1.5G FREQUENCY (Hz) FIGURE 1. |Sds21| vs FREQUENCY 0 -5 -10 -15 -20 -25 -30 0 0.5G 1.0G 1.5G FREQUENCY (Hz) FIGURE 3. ...

Page 5

Typical Performance (II) 50Ω Environment 0.5G 1.0G 1.5G FREQUENCY (Hz) FIGURE 7. |S21| vs FREQUENCY -10 -12 -14 0 0.5G 1.0G 1.5G FREQUENCY (Hz) FIGURE 9. |S11| ...

Page 6

Typical Performance (III -10 -12 0 0.5G 1.0G 1.5G FREQUENCY (Hz) FIGURE 13. |S33| vs FREQUENCY PIN 500M 1G FREQUENCY (Hz) FIGURE 15. 1dB ...

Page 7

Typical Performance (IV) 50Ω Environment FUNDAMENTAL (1GHz AND 1.1GHz) -10 -20 -30 IM2 (2.1GHz) -40 -50 -16 -15 -14 -13 -12 INPUT POWER (dBm) FIGURE 19. IM2 OF PIN 4 vs INPUT POWER 60 PIN 5 50 ...

Page 8

Typical Performance (V) 50Ω Environment 27Ω 500M 1G FREQUENCY (Hz) FIGURE 25. DIFFERENTIAL P1dB vs FREQUENCY 500M 1G 1.5G 2.0G ...

Page 9

ISL55012 VDD VDD C GND ISL55016 FIGURE 30. COMPARISON OF ISL55012 WITH A BALUN AND ISL55016 (RELATIVE SIZE Trade-off Between Power and OIP2 The values of R and R (Figure 29) ...

Page 10

... Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use ...

Page 11

Package Outline Drawing L6.1.6x1.6B 6 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (TDFN) Rev 1, 03/07 1.60 6 PIN 1 INDEX AREA (4X) 0.15 TOP VIEW ( 1.00 0.60 1.12 TYPICAL RECOMMENDED LAND PATTERN ...

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