75003-0210 Molex Inc, 75003-0210 Datasheet - Page 4
![CONN PLUG 72POS 1.2MM VERT SMD](/photos/24/92/249296/3808115_sml.jpg)
75003-0210
Manufacturer Part Number
75003-0210
Description
CONN PLUG 72POS 1.2MM VERT SMD
Manufacturer
Molex Inc
Series
Plateau HS Mezz™ 75003r
Datasheets
1.75005-0306.pdf
(7 pages)
2.75005-0306.pdf
(9 pages)
3.75005-0306.pdf
(12 pages)
4.75003-0210.pdf
(8 pages)
Specifications of 75003-0210
Connector Type
Differential Pair Array, Male
Number Of Positions
72
Pitch
0.047" (1.20mm)
Number Of Rows
2
Mounting Type
Surface Mount
Features
Board Guide
Contact Finish
Gold
Contact Finish Thickness
30µin (0.76µm)
Mated Stacking Heights
15mm, 17mm, 25mm
Height Above Board
0.522" (13.25mm)
Pitch Spacing
1.2mm
No. Of Contacts
72
Gender
Plug
Contact Plating
Gold
No. Of Rows
2
Contact Termination
Surface Mount Vertical
Product Type
Receptacles
Mounting Style
Wire
Number Of Positions / Contacts
6
Housing Material
High Temperature Thermoplastic
Contact Material
High Performance Alloy (HPA)
Voltage Rating
30 V
Current Rating
1.5 A
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
075003-0210
075003-0210-E
0750030210
0750030210-E
75003-0210-E
750030210
750030210-E
WM17217
075003-0210-E
0750030210
0750030210-E
75003-0210-E
750030210
750030210-E
WM17217
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
75003-0210
Manufacturer:
Molex, LLC
Quantity:
12 000
REVISION:
DOCUMENT NUMBER:
B
5.4 Environmental Performance
PS-75005-001
5.3.2 Durability: Mate and unmate for 25 cycles at 500 cycles per hour, without physical damage
5.3.3 Durability (Preconditioning): Mate and unmate for 5 cycles at 500 cycles per hour, without
5.3.4 Reseating: Mate and unmate for 3 cycles, without physical damage.
5.3.4 Vibration: There shall be no evidence of physical damage or a change in contact resistance
5.3.6 Retention Force (Chicklet to Housing): Specimens shall remain mated when a force of
5.3.7 Axial Force (Soldered Housing to Board): Specimens shall remain attached to the board
5.3.8 Side Load Force (Soldered Housing to Board): Specimens shall remain attached to the
5.4.1 Thermal Shock: There shall be no change in contact resistance greater than 10mOhms from
ECR/ECN INFORMATION:
EC No:
DATE:
# of Ckts
12
24
48
72
or exceeding a change in contact resistance of 10 mOhms. Test per EIA-364-09.
physical damage or exceeding a change in contact resistance of 10 mOhms. Test per EIA-
364-09.
of 10 mOhms when mated specimens are subjected to 3.10 G’s rms between 20-500 Hz
for 15 minutes in each of 3 mutually perpendicular planes(X-Y-Z). Test per EIA-364-28,
Test Condition VII, Condition D.
3.33N is applied. The load shall be applied in the axial direction. Test per EIA-364-38.
when a minimum force of 26.69 N per ground peg is applied. See Table. Assumes 50%
peg coverage with solder fillet at the top, per AS-75005-001.
board when a minimum force of 17.79 N per ground peg is applied. See Table. Assumes
50% peg coverage with solder fillet at the top, per AS-75005-001.
initial when mated specimens are subjected to 10 cycles between -55
minute dwell times. Test per EIA-364-32, Condition 1.
UCP2003-2204
2003 / 04 / 10
PRODUCT SPECIFICATION
HIGH SPEED MEZZANINE
# Differential
TITLE:
CREATED / REVISED BY:
Pairs
12
24
36
6
Ken Stiles
BOARD TO BOARD CONNECTOR SYSTEM
PRODUCT SPECIFICATION FOR THE
HIGH SPEED MEZZANINE
Axial Force (N)
160.14
240.21
53.38
80.07
Min
CHECKED BY:
Ken Stiles
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
Side Load Force (N)
106.74
160.11
o
35.58
53.37
Min
C and 85
Manny Banakis
APPROVED BY:
o
C with 30
SHEET No.
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