QFSS-104-04.25-H-D-A Samtec Inc, QFSS-104-04.25-H-D-A Datasheet

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QFSS-104-04.25-H-D-A

Manufacturer Part Number
QFSS-104-04.25-H-D-A
Description
CONN RCPT .635MM 208POS DUAL SMD
Manufacturer
Samtec Inc
Series
Q2&tade; QFSSr

Specifications of QFSS-104-04.25-H-D-A

Connector Type
Receptacle, Center Strip Contacts
Number Of Positions
208
Pitch
0.025" (0.64mm)
Number Of Rows
2
Mounting Type
Surface Mount
Features
Board Guide, Ground Bus (Plane), Shielded
Contact Finish
Gold
Contact Finish Thickness
30µin (0.76µm)
Mated Stacking Heights
11mm
Height Above Board
0.278" (7.06mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
QFSS-104-01-H-D-A
SAM8172

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
QFSS-104-04.25-H-D-A
Manufacturer:
Samtec Inc.
Quantity:
12 000
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?QFSS
Insulator Material:
Liquid Crystal
Polymer
Contact, Ground
Plane & Shield Material:
Phosphor Bronze
Plating:
Au over 50µ" (1,27µm) Ni
(Tin on Ground Plane tails)
Current Rating:
Signal Contact: 1.8A @ 80°C
Power Contact: 3.95A @ 80°C
Ground Plane: 8.9A @ 80°C
Voltage Rating:
300 VAC mated with QMSS
Operating Temp:
-55°C to +125°C
RoHS Compliant:
Yes
Processing:
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10mm) .004" max (026-078)
(0,15mm) .006" max (104)
Board Stacking:
For applications requiring
more than two connectors
per board or 4 banks or more,
contact ipg@samtec.com
Note: Some lengths,
styles and options are
non-standard, non-returnable.
F-211
SHIELDED GROUND PLANE SOCKET
SPECIFIC OPTION
• Headers without
• 8 Power Pins/End
• 4 or 8 Power Pins/End
• Guide Holes
• Hot Pluggable
Call Samtec.
SPECIFICATIONS
(0,635mm) .025"
QFSS SERIES
Alignment Pins
for (2,36mm) .093"
thick board
APPLICATION
APPLICATION
QFSS
QMSS
(11.00)
.433
Board Mates:
QMSS
Cable Mates:
6QDPS
QFSS
(8,13)
(0,89)
.320
.035
See SO Series for precision
See SO Series for precision
APPLICATIONS
TM
40 signals + 12 grounds to shield = –D)
–026, –052, –078, –104
–016, –032, –048, –064
(2,00) .07874
machined standoffs.
No. of Banks x (21,34) .840 + (12,87) .507
No. of Banks x (21,34) .840 + (1,02) .040
(16 pairs per bank = –D–DP)
(2,10) .083
PINS PER ROW
(21,34) .840
(52 total pins per bank
• Increased
• Integral guide post
NO. OF PAIRS
insertion depth
–D
(0,635)
.025
–PC4 OPTION
WWW.SAMTEC.COM
QFSS–052–04.25–L–D–PC4
QFSS–026–04.25–L–D–A
(0,23)
.009
(1,02) .040 DIA
–D–DP
Standard shield grounding is
GSSSSG. Application
Specifi c options
available.
04.25
Single-Ended
Signal routing.
02
01
02
01
(7,06)
.278
(2,54)
.100
Pins, Shield and
PLATING
= 10µ" (0,25µm)
Signal Pin tails,
OPTION
Gold on Signal
Tin on Ground
(Gold fl ash on
Ground Plane
Plane tails)
11mm Stack Height
Single-Ended Signaling
Differential Pair Signaling
Performance data for other stack heights and complete
test data available at www.samtec.com?QFSS or
contact sig@samtec.com
–L
(7,44)
.293
(1,78)
.070
(8,13)
.320
TYPE
Increased insertion
depth for rugged application
(0,10)
(2,54)
.004
.100
= Differential Pair
= Single-Ended
–D–DP
–D
Based on ± 10% Impedance/Crosstalk
QFSS–078–04.25–L–D–A
A
2.3 GHz / 4.6 Gbps
1.4 GHz / 2.8 Gbps
11mm
Stack Height
NOMINAL
(1,30mm)
OPTION
–104 or –A)
WIPE
.051"
OTHER
= 4 Power
–PC4
Pins/End
(N/A with

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