HLMP-ED25-TW000 Avago Technologies US Inc., HLMP-ED25-TW000 Datasheet - Page 11
![LED 5MM 639NM RED WATER CLEAR](/photos/8/10/81006/fig_11_yellow_sml.jpg)
HLMP-ED25-TW000
Manufacturer Part Number
HLMP-ED25-TW000
Description
LED 5MM 639NM RED WATER CLEAR
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HLMP-ED31-SV000.pdf
(13 pages)
Specifications of HLMP-ED25-TW000
Viewing Angle
23°
Color
Red
Luminous Flux @ Current - Test
1 lm
Millicandela Rating
4850mcd
Current - Test
20mA
Wavelength - Dominant
630nm
Wavelength - Peak
594nm
Voltage - Forward (vf) Typ
2.4V
Lens Type
Clear
Lens Style/size
Round, 5mm, T-1 3/4
Package / Case
Radial - 2 Lead
Height
8.71mm
Mounting Type
Through Hole
Resistance Tolerance
630nm
Bulb Size
T-1 3/4 (5mm)
Led Color
Red
Luminous Intensity
7.2cd
Forward Current If
20mA
Forward Voltage
2.4V
Led Mounting
Through Hole
Lens Shape
Round
Wavelength Typ
630nm
Lead Spacing
2.54mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
516-1369
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HLMP-ED25-TW000
Manufacturer:
AVAGO
Quantity:
40 000
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
Ammo Pack Drawing
11
(0.7087 ± 0.0197)
ALL DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF.
18.00 ± 0.50
250
200
150
100
50
0
(0.3593 ± 0.0246)
9.125 ± 0.625
10
(0.25 ± 0.0512)
6.35 ± 1.30
20
30
PREHEAT
TURBULENT WAVE
(0.50 ± 0.0118)
12.70 ± 0.30
40
TIME (MINUTES)
(0.50 ± 0.0394)
12.70 ± 1.00
CATHODE
50
(0.0276 ± 0.0079)
0.70 ± 0.20
60
70
A
LAMINAR WAVE
VIEW A–A
HOT AIR KNIFE
80
A
90
100
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be
sufficiently cooled to room
temperature before exerting
mechanical force.
∅ 4.00 ± 0.20
(0.1575 ± 0.008)
(0.807 ± 0.039)
20.50 ± 1.00
TYP.