NCV7680PWR2G ON Semiconductor, NCV7680PWR2G Datasheet - Page 7

• Manufacturer Part Number: NCV7680PWR2G
• Description: IC LED REAR COMBO LAMP 16SOIC
• Manufacturer: ON Semiconductor

Specifications of NCV7680PWR2G

• Constant Current: Yes
• Topology: Linear (LDO), PWM
• Number Of Outputs: 8
• Internal Driver: Yes
• Type - Primary: Automotive, Backlight
• Voltage - Supply: 6 V ~ 16 V
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.300", 7.50mm Width)
• Current - Output / Channel: 75mA
• Output Type: Fixed
• Input Voltage Max: 5 V
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 40 C
• Operating Temperature Range: - 40 C to + 150 C
• Operating Temperature (max): 150C
• Operating Temperature (min): -40C
• Pin Count: 16
• Mounting: Surface Mount
• Package Type: SOIC W
• Screening Level: Automotive
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Output: -
• Frequency: -
• Operating Temperature: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: NCV7680PWR2G; NCV7680PWR2GOSTR

ELECTRICAL CHARACTERISTICS
otherwise specified) (Note 4)
GENERAL PARAMETERS
CURRENT SOURCE OUTPUTS
FET DRIVER
4. Designed to meet these characteristics over the stated voltage and temperature recommended operating ranges, though may not be 100%
5. Guaranteed by design.
Quiescent Current (I
Output Current
Maximum Regulated Output
Current
Current Matching
Line Regulation
Open Circuit Detection Threshold
Current Slew Rate
Overvoltage Set Back Threshold
Overvoltage Set Back Current
Diag Reporting of Set Back
Current
Output Disable Threshold
Ballast Drive
Leakage Current
Sink Current
Ballast Drive Reference Voltage
parametrically tested in production.
Characteristic
STOP Mode, 8 Channel
STOP Mode, 4 Channel
Tail Mode
Table 3. ATTRIBUTES
2. For additional information, see or download ON Semiconductor’s Soldering and Mounting Tech-
3. Values represent typical still air steady−state thermal performance on 1 oz. copper FR4 PCB with
OUTx
ESD Capability
Moisture Sensitivity Level
Storage Temperature
Package Thermal Resistance (Note 3)
Junction−to−Board (R
Junction−to−Ambient (R
Junction−to−Pin (R
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
niques Reference Manual, SOLDERRM/D, and Application Note AND8003/D.
650 mm
= 35 mA)
−40°C
150°C
25°C
2
copper area.
V
V
V
OUTX = 1.0 V, T
OUTX = 1.0 V, T
6 V v V
I
@ 99% I
V
FB = 1.5 V, Ballast Drive = 3 V
FB = 0.5 V, Ballast Drive = 3 V
OUT
P
P
P
P
YJL
= 16 V
= 16 V, OUT5 = OUT6 = OUT7 = OUT8 = GND
= 16 V
= 20 V
(6 V < V
Human Body Model (All Remaining Pins)
= 35 mA, 10% to 90% Points
YJB
)
Characteristics
qJA
P
OUT
)
v 16 V
)
I
I
OUTx(min)
OUTx(min)
Human Body Model (RSTOP Pin)
P
< 16 V, V
J
J
2I
2I
= 25°C, 150°C
= −40°C
OUTx(max)
OUTx(min)
http://onsemi.com
) I
) I
STOP
Conditions
OUTx(max)
OUTx(max)
= V
Machine Model
7
P
, R
STOP
* 1
* 1
(Note 2)
= 3.09 kW, R
100
100
TAIL
−55°C to 150°C
> $1.8 kV
> $2.0 kV
> $200 V
= 2.21 kW, −40°C v T
27°C/W
78°C/W
38°C/W
MSL 1
Value
31.5
30.8
16.0
0.95
Min
0.3
75
−7
−6
−5
−
−
−
−
−
−
−
−
−
4
18.7
1.05
Typ
100
6.5
6.4
6.0
0.6
0.4
6.0
35
35
94
80
−
0
0
0
0
5
J
v 150°C, unless
Max
38.5
39.2
24.5
1.15
250
8.0
8.0
8.0
3.0
0.5
25
10
−
7
6
5
−
−
−
%I
%I
mA/us
Unit
mA
mA
mA
mA
mV
mA
mA
%
%
%
V
V
V
OUT
OUT