AD7606BSTZ Analog Devices Inc, AD7606BSTZ Datasheet - Page 11

• Manufacturer Part Number: AD7606BSTZ
• Description: IC DAS W/ADC 16BIT 8CH 64LQFP
• Manufacturer: Analog Devices Inc
• Type: Data Acquisition System (DAS), ADCr

Specifications of AD7606BSTZ

• Resolution (bits): 16 b
• Data Interface: DSP, MICROWIRE™, Parallel, QSPI™, Serial, SPI™
• Design Resources: Layout Considerations for an Expandable Multichannel Simultaneous Sampling Data Acquisition System Based on AD7606 (CN0148)
• Sampling Rate (per Second): 200k
• Voltage Supply Source: Single Supply
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 64-LFQFP
• Sampling Rate: 200kSPS
• Input Channel Type: Single Ended
• Supply Voltage Range - Analog: 4.75V To 5.25V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
T
Table 4.
Parameter
AV
V
Analog Input Voltage to AGND
Digital Input Voltage to DGND
Digital Output Voltage to GND
REFIN to AGND
Input Current to Any Pin Except Supplies
Operating Temperature Range
Storage Temperature Range
Junction Temperature
Pb/SN Temperature, Soldering
Pb-Free Temperature, Soldering Reflow
ESD (All Pins Except Analog Inputs)
ESD (Analog Input Pins Only)
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Transient currents of up to 100 mA do not cause SCR latch-up.
DRIVE
A
B Version
Reflow (10 sec to 30 sec)
CC
= 25°C, unless otherwise noted.
to AGND
to AGND
1
1
Rating
−0.3 V to +7 V
−0.3 V to AV
±16.5 V
−0.3 V to V
−0.3 V to V
−0.3 V to AV
±10 mA
−65°C to +150°C
−40°C to +85°C
150°C
240 (+0)°C
260 (+0)°C
2 kV
7 kV
DRIVE
DRIVE
CC
CC
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
Rev. A | Page 11 of 36
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages. These
specifications apply to a 4-layer board.
Table 5. Thermal Resistance
Package Type
64-Lead LQFP
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
AD7606/AD7606-6/AD7606-4
θ
45
JA
θ
11
JC
Unit
°C/W