C5750X7R1E156MT5 TDK Corporation, C5750X7R1E156MT5 Datasheet - Page 13
![CAP CER 15UF 25V X7R 20% 2220](/photos/29/20/292011/c5750_series_sml.jpg)
C5750X7R1E156MT5
Manufacturer Part Number
C5750X7R1E156MT5
Description
CAP CER 15UF 25V X7R 20% 2220
Manufacturer
TDK Corporation
Series
Cr
Specifications of C5750X7R1E156MT5
Capacitance
15µF
Tolerance
±20%
Package / Case
2220 (5750 Metric)
Voltage - Rated
25V
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Features
Low ESR
Applications
General Purpose
Size / Dimension
0.224" L x 0.197" W (5.70mm x 5.00mm)
Thickness
2.80mm
Voltage Rating
25 Volts
Operating Temperature Range
- 55 C to + 125 C
Temperature Coefficient / Code
X7R
Product
Open Mode/Fail-Safe MLCC
Dimensions
5 mm W x 5.7 mm L x 2.3 mm H
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Ratings
-
Lead Spacing
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
445-6120-2
• All specifications are subject to change without notice. Please read the precautions before using the product.
Material : Glass Epoxy ( As per JIS C6484 GE4 )
P.C. Board thickness: 1.6mm
General
Specifications
c
Solder Resist
Copper ( thickness 0.035mm )
Solder resist
P.C. Board for reliability test
Applied for C2012, C3216
Appendix - 1a
100 mm
Copper
Solder Resist
P.C. Board for bending test
Appendix - 2b
100 mm
b
C Series — Open Mode Design
a
C2012
C3216
C3225
C4532
C5750
JIS
Copper
Case Code
c
US Catalog // C Series — Open Mode Design // Version A11
CC0805
CC1206
CC1210
CC1812
CC2220
Applied for C3225, C4532, C5750
EIA
P.C. Board for reliability test
Slit
Appendix - 1b
100 mm
1.2
2.2
2.2
3.5
4.5
a
Solder Resist
Dimensions (mm)
4.0
5.0
5.0
7.0
8.0
b
Copper
1.65
2.0
2.9
3.7
5.6
c