BM10B(0.6)-10DP-0.4V(75) Hirose Electric Co Ltd, BM10B(0.6)-10DP-0.4V(75) Datasheet - Page 9
![CONN HDR 10POS 0.4MM SMD GOLD](/photos/16/87/168753/bm10_sml.jpg)
BM10B(0.6)-10DP-0.4V(75)
Manufacturer Part Number
BM10B(0.6)-10DP-0.4V(75)
Description
CONN HDR 10POS 0.4MM SMD GOLD
Manufacturer
Hirose Electric Co Ltd
Series
BM10r
Datasheets
1.BM10B0.6-10DP-0.4V51.pdf
(15 pages)
2.BM10B0.6-10DP-0.4V51.pdf
(1 pages)
3.BM10B0.8-30DP-0.4V51.pdf
(1 pages)
Specifications of BM10B(0.6)-10DP-0.4V(75)
Connector Type
Header, Outer Shroud Contacts
Number Of Positions
10
Pitch
0.016" (0.40mm)
Number Of Rows
2
Mounting Type
Surface Mount
Features
Solder Retention
Contact Finish
Gold
Contact Finish Thickness
3.9µin (0.10µm)
Mated Stacking Heights
0.6mm
Product Type
PCB
Number Of Positions / Contacts
10
Mounting Angle
Vertical
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Height Above Board
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
BM10B(0.6)-10DP-0.4V(75)
Manufacturer:
Hirose Electric Co Ltd
Quantity:
12 000
[Reflow condition for Nickel barrier evaluation]
Temperature profile: Max 260 °C, Oxygen density: Max 1000 ppm (N
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Specifications herein are subject to change without notice.
Contact Hirose for latest specification, drawings, or availabilities.
Contact point
Receptacle
Solder Wicking Prevention
Nickel barrier prevents solder wicking.
plating
Gold
Nickel barrier
Contact
point
plating
Gold
Issued: Mar. 31, 2010
Header
ITS-P-08016NB_.2 (Page 9 of 15)
2
Nickel barrier
reflow)
Image: 0.8 mm stacking height
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