WB3F200VD1 JAE Electronics, WB3F200VD1 Datasheet

WB3F200VD1

Manufacturer Part Number

WB3F200VD1

Description

CONN RCPT 200POS VERT 0.5MM GOLD

Manufacturer

JAE Electronics

Series

WB3r

Datasheets

1.AA03-P020VA2-R6000.pdf (2 pages)

2.WB3F200VD1T.pdf (5 pages)

Specifications of WB3F200VD1

Connector Type

Receptacle, Center Strip Contacts

Number Of Positions

200

Pitch

0.020" (0.50mm)

Number Of Rows

Mounting Type

Surface Mount

Features

Board Guide

Contact Finish

Gold

Contact Finish Thickness

30µin (0.76µm)

Mated Stacking Heights

4mm, 5mm

Height Above Board

0.098" (2.50mm)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

670-2350

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

WB3F200VD1

Manufacturer:

JAE Electronics

Quantity:

12 000

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

WB3F200VD1R1000

Manufacturer:

JAE

Quantity:

29 326

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

WB3F200VD1T

Manufacturer:

JAE Electronics

Quantity:

12 000

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

WB3F200VD1TR1000

Manufacturer:

JAE Electronics

Quantity:

12 000

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

WB3F200VD1TR1000

Manufacturer:

JAE

Quantity:

30 052

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COMPONENTS PRODUCT INFORMATION

NEW

WB3 Series are board to board connectors satisfying the specification of the

transmission characteristics of PCI Express standard.

Suitable for connections between units that need TMDS transmission, such as

graphic card and PCI Express.

RoHS　Compliant

and high speed transmission is possible.

and others.

available.

Compliant with PCI Express Card Electrical Mechanical SPEC

High density 0.5mm pitch type yet having a high level transmission characteristic　

Contact configuration that enables transmission of PCI Express(X16), TMDS, VGA

Parallel board to board connection is possible. Stacking height, 4mm and 5mm are

EMI shielding is applied.

Compatible to automatic mounting. Available in embossed tape package.

No. of contacts: 200 pos.

Contact resistance: 50m ohm max.

Dielectric withstanding voltage: AC250V per minute

Operating temperature: -40 Deg. C to +85 Deg. C

Rated current: 0.5A/ per pin

Mating cycle: 25 cycle

Insertion loss: -1dB min. (1.25GHz max.)/-5dB min. (3.75GHz max.)

Return loss: -12dB max. (1.3Ghz max.)/ -7dB max. (2Ghz max.)/ -4dB (3.75GHz max.)

Crosstalk(near end): -32dB max. (1.25Ghz max.)/ -26dB max. (3.75GHz max.)

General Specifications

Features

Board to Board Connector Compatible to PCI Express

WB3 Series

CONNECTOR

MB-0138-2

July 2006

1/5

Related parts for WB3F200VD1

WB3F200VD1 Summary of contents

Page 1

COMPONENTS PRODUCT INFORMATION NEW Board to Board Connector Compatible to PCI Express RoHS　Compliant WB3 Series are board to board connectors satisfying the specification of the transmission characteristics of PCI Express standard. Suitable for connections between units that need TMDS transmission, ...

Page 2

Materials and Finishes Components Contact Insulator Shell Contact Insulator Shell Ordering Information WB3 F Series F: Receptacle portion M: Plug portion No. of contacts V: Straight SMT, with hold down JAE PMK Div. Proprietary. Copyright ©　2006，Japan Aviation Electronics Industry, Ltd. ...

Page 3

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Plug side: WB3M200VD2　　(SJ100892)　 Embossed reel product: WB3M200VD2R1000 (SJ100893) Japan Aviation Electronics Industry, Limited Product Marketing Division Aobadai Building, 3-1-19, Aobadai, Meguro-ku, Tokyo 153-8539 Phone: +81-3-3780-2787 FAX: +81-3-3780-2946 * The specifications in this brochure are subject to change without notice. Please ...

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