DF12B(5.0)-60DP-0.5V(86) Hirose Electric Co Ltd, DF12B(5.0)-60DP-0.5V(86) Datasheet - Page 11

• Manufacturer Part Number: DF12B(5.0)-60DP-0.5V(86)
• Description: CONN HEADER 60POS 0.5MM SMD GOLD
• Manufacturer: Hirose Electric Co Ltd
• Series: DF12r

Specifications of DF12B(5.0)-60DP-0.5V(86)

• Pitch: 0.020" (0.50mm)
• Number Of Rows: 2
• Connector Type: Header, Outer Shroud Contacts
• Number Of Positions: 60
• Mounting Type: Surface Mount
• Features: Solder Retention
• Contact Finish: Gold
• Contact Finish Thickness: 8µin (0.20µm)
• Mated Stacking Heights: 5mm
• Height Above Board: 0.169" (4.30mm)
• Product Type: Headers
• Stack Height: 5 mm
• Mounting Style: SMD/SMT
• Mounting Angle: Vertical
• Number Of Positions / Contacts: 60
• Contact Material: Phosphor Copper
• Contact Plating: Gold
• Voltage Rating: 50 V
• Current Rating: 0.3 A
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: DF12B(5.0)-60DP-0.5V(86); H11764TR; Q2640639A

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
BPrecautions for Use
1.Recommended Temperature Profile (SMT)
2.Recommended Manual Soldering Condition (SMT) Soldering iron temperature: 350 , Soldering time: Within 3 seconds
3.Recommended Screen Thickness and 0.12mm
4.Board Warp(SMT)
5.Cleaning Condition
6.Cautions
open area ratio(Pattern area ratio)
Note1: UP to 2 cycles of Reflow soldering are possible under the
Note2: The temperature profile indicates the board surface
Open area ratio: 70%
Maxmum 0.02mm in the connector center area, based on both connector edges
Refer to "Nylon Connector Use Hand book".
The receptacle is designed in a structure where contacts are exposed. Touching it with
bare hands would cause contact failure or electrostatic element damage.
Where no board is mounted, the insertion or extraction will cause damage or
contact deformation.
Avoid retaining the board with the connector only, and fix the board by any other means
than the connector.
Excessive scoop insertion or extraction may result in damage.
In the manual soldering process, don't carry out the flux coating which will cause a flux
blister on the connector.
The color phase of this product may be slightly different from that of the formed product
according to the manufacturing lot. However, the difference doesn't affect the performance.
same conditions, provided that there is a return to normal
temperature between the first and second cycle.
temperature at the point of contacts with the connector
terminals.
DF12 Series 0.5mm Pitch SMT Board to Board Connector
A203