75005-0204 Molex Inc, 75005-0204 Datasheet - Page 6
![CONN RECEPT 72POS 1.2MM VERT SMD](/photos/1/80/18088/75005-0204_sml.jpg)
75005-0204
Manufacturer Part Number
75005-0204
Description
CONN RECEPT 72POS 1.2MM VERT SMD
Manufacturer
Molex Inc
Series
Plateau HS Mezz™ 75005r
Datasheets
1.75005-0306.pdf
(7 pages)
2.75005-0306.pdf
(9 pages)
3.75005-0306.pdf
(12 pages)
4.75005-0204.pdf
(3 pages)
Specifications of 75005-0204
Connector Type
Differential Pair Array, Female
Number Of Positions
72
Pitch
0.047" (1.20mm)
Number Of Rows
2
Mounting Type
Surface Mount
Features
Board Guide
Contact Finish
Gold
Contact Finish Thickness
30µin (0.76µm)
Mated Stacking Heights
10mm, 13mm, 15mm
Height Above Board
0.285" (7.24mm)
Pitch Spacing
1.2mm
No. Of Contacts
72
Gender
Receptacle
Contact Plating
Gold
No. Of Rows
2
Contact Termination
Surface Mount Vertical
Product Type
Receptacles
Mounting Style
Wire
Mounting Angle
Vertical
Number Of Positions / Contacts
16
Housing Material
High Temperature Thermoplastic
Contact Material
High Performance Alloy (HPA)
Voltage Rating
30 V
Current Rating
1.5 A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
075005-0204
0750050204
750050204
WM17207TR
0750050204
750050204
WM17207TR
REVISION:
DOCUMENT NUMBER:
C
5.2 Recommended Reflow and Rework Temperatures:
Initial Attach:
1) Maximum Reflow Temperature: 240
2) Maximum Reflow Shear Rate: 2
Rework:
1) Rework of the connector requires a full replacement.
2) Rework of the connector requires that after removal of the initial part all Thru Holes and SMT pads must be
3) Rework of the connector requires that a proper solder stencil be used to apply the paste for attaching the new
4) Rework of connector requires following the same temperature restrictions as the Initial Attach. A maximum
5.3 Recommended PCB Thickness:
The recommended board thickness for the High Speed Mezzanine connector is 1.57mm thick.
However, the connector is fully capable of being used in thicker boards, the only limitations are that it maintain
a minimum of 50% peg coverage with a solder fillet.
AS-75005-001
fully cleaned. No debris or solder is allowed.
connector. See Section 5.1 for a recommended stencil layout.
reflow temp of 240
Circuit Trace
Circuit Trace
ECR/ECN INFORMATION:
EC No:
DATE:
UCP2003-2204
2003 / 04 / 09
APPLICATION SPECIFICATION
o
C
HIGH SPEED MEZZANINE
and a maximum shear rate of 2
TITLE:
CREATED / REVISED BY:
o
C
/second
Ken Stiles
o
C
BOARD TO BOARD CONNECTOR SYSTEM
APPLICATION SPECIFICATION FOR THE
for no longer than 30 seconds.
HIGH SPEED MEZZANINE
o
C
/second.
CHECKED BY:
Ken Stiles
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
Board Thickness
Board Thickness
Solder Fillet
Solder Fillet
“T”
“T”
Manny Banakis
APPROVED BY:
SHEET No.
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