75005-0104 Molex Inc, 75005-0104 Datasheet - Page 4

• Manufacturer Part Number: 75005-0104
• Description: CONN RECEPT 48POS 1.2MM VERT SMD
• Manufacturer: Molex Inc
• Series: Plateau HS Mezz™ 75005r

Specifications of 75005-0104

• Connector Type: Differential Pair Array, Female
• Number Of Positions: 48
• Pitch: 0.047" (1.20mm)
• Number Of Rows: 2
• Mounting Type: Surface Mount
• Features: Board Guide
• Contact Finish: Gold
• Contact Finish Thickness: 30µin (0.76µm)
• Mated Stacking Heights: 10mm, 13mm, 15mm
• Height Above Board: 0.285" (7.24mm)
• Pitch Spacing: 1.2mm
• No. Of Contacts: 48
• Gender: Receptacle
• Contact Plating: Gold
• No. Of Rows: 2
• Contact Termination: Surface Mount Vertical
• Product Type: Receptacles
• Mounting Style: Wire
• Mounting Angle: Vertical
• Number Of Positions / Contacts: 14
• Housing Material: High Temperature Thermoplastic
• Contact Material: High Performance Alloy (HPA)
• Voltage Rating: 30 V
• Current Rating: 1.5 A
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 075005-0104; 0750050104; 750050104; WM17206TR

REVISION:
DOCUMENT NUMBER:
4.3 Additional Testing
B
Test # Board Thickness
Notes:
1
2
3
4
5
6
TS-75005-001
ECR/ECN INFORMATION:
EC No:
DATE:
1) The sample size for sequence A consisted of 3 Assemblies (75005-0006 and 75003-0008).
2) The sample size for sequence B consisted of 30 Individual Contact Pairs and 1 Fully Powered
3) The sample size for sequence C consisted of 5 Assemblies (75005-0006 and 75003-0008).
4) The sample size for sequence D consisted of 24 chicklets of both types (75005-0006 and
5) The stressed test sequence consisted of 3 environmental sequences. Thermal Shock : 10
6) Reworked parts were subjected to 2 rework cycles.
Dielectric Withstanding Voltage (5.2.2)
Insulation Resistance (5.2.3)
Thermal Shock (5.4.1)
Humidity - Temp. Cycling (5.4.4)
Temperature Rise (5.4.8)
Mating Force (5.3.1)
Unmating Force (5.3.1)
Retention Force - Chicklet to Housing (5.3.6)
Axial Pull of Soldered Assemblies (5.3.7)
Side Load of Soldered Assemblies (5.3.8)
Plating Adhesion (5.4.9)
0.062
0.072
0.072
0.072
0.072
0.072
75003-0008).
Cycles of -40
Assembly. (This testing consisted of P/N 74874-0006 which was replaced by P/N’s 75005-
0006 and 75003-0008 however the electrical interface did not change.)
extremes. Temperature Cycling: 500 Cycles of -40
Ramp < 20
UCP2003-2204
2003 / 04 / 10
EIA 364 Samples
Unstressed - 50% Fill
Unstressed - Normal Process
Unstressed - Normal Process, Soldered Locating Pegs (10) 75005-2000 (10) 75003-2000
Stressed - Normal Process (see note 5)
Reworked Parts (see note 6)
Test or Examination
o
HIGH SPEED MEZZANINE
C/minute. Humidity: 500 Hours at 85
o
C to 65
TITLE:
CREATED / REVISED BY:
TEST SUMMARY
o
C, 10 minute dwell at extremes, Ramp < 2 minutes between
Ken Stiles
Description
BOARD TO BOARD CONNECTOR SYSTEM
Test Sequence E
TEST SUMMARY FOR THE
HIGH SPEED MEZZANINE
Additional Test Sequences
2, 5
A
1
3
4
CHECKED BY:
o
Ken Stiles
C and 85% RH
o
C to 65
B
1
(10) 75005-2000 (10) 75003-2000
(10) 75005-2000 (10) 75003-2000
(10) 75005-2000 (10) 75003-2000
(10) 75005-2000 (10) 75003-2000
(4) 75005-0006 (4) 75003-0008
Receptacles
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
C
1
2
o
C, 10 minute dwell at extremes,
D
1
Sample Size
E
2
1
Manny Banakis
APPROVED BY:
F
1
Plugs
SHEET No.
4
of
20