75005-0306 Molex Inc, 75005-0306 Datasheet - Page 6

• Manufacturer Part Number: 75005-0306
• Description: CONN RECEPT 12POS 1.2MM VERT SMD
• Manufacturer: Molex Inc
• Series: Plateau HS Mezz™ 75005r

Specifications of 75005-0306

• Connector Type: Differential Pair Array, Female
• Number Of Positions: 12
• Pitch: 0.047" (1.20mm)
• Number Of Rows: 2
• Mounting Type: Surface Mount
• Features: Board Guide
• Contact Finish: Gold
• Contact Finish Thickness: 30µin (0.76µm)
• Mated Stacking Heights: 12mm, 15mm, 17mm
• Height Above Board: 0.364" (9.25mm)
• Pitch Spacing: 1.2mm
• No. Of Contacts: 12
• Gender: Receptacle
• Contact Plating: Gold
• No. Of Rows: 2
• Contact Termination: Surface Mount Vertical
• Product Type: Receptacles
• Mounting Style: Wire
• Mounting Angle: Vertical
• Number Of Positions / Contacts: 20
• Housing Material: High Temperature Thermoplastic
• Contact Material: High Performance Alloy (HPA)
• Voltage Rating: 30 V
• Current Rating: 1.5 A
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 075005-0306; 0750050306; 750050306; WM17203TR

REVISION:
DOCUMENT NUMBER:
C
5.2 Recommended Reflow and Rework Temperatures:
Initial Attach:
1) Maximum Reflow Temperature: 240
2) Maximum Reflow Shear Rate: 2
Rework:
1) Rework of the connector requires a full replacement.
2) Rework of the connector requires that after removal of the initial part all Thru Holes and SMT pads must be
3) Rework of the connector requires that a proper solder stencil be used to apply the paste for attaching the new
4) Rework of connector requires following the same temperature restrictions as the Initial Attach. A maximum
5.3 Recommended PCB Thickness:
The recommended board thickness for the High Speed Mezzanine connector is 1.57mm thick.
However, the connector is fully capable of being used in thicker boards, the only limitations are that it maintain
a minimum of 50% peg coverage with a solder fillet.
AS-75005-001
fully cleaned. No debris or solder is allowed.
connector. See Section 5.1 for a recommended stencil layout.
reflow temp of 240
Circuit Trace
Circuit Trace
ECR/ECN INFORMATION:
EC No:
DATE:
UCP2003-2204
2003 / 04 / 09
APPLICATION SPECIFICATION
o
C
HIGH SPEED MEZZANINE
and a maximum shear rate of 2
TITLE:
CREATED / REVISED BY:
o
C
/second
Ken Stiles
o
C
BOARD TO BOARD CONNECTOR SYSTEM
APPLICATION SPECIFICATION FOR THE
for no longer than 30 seconds.
HIGH SPEED MEZZANINE
o
C
/second.
CHECKED BY:
Ken Stiles
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
Board Thickness
Board Thickness
Solder Fillet
Solder Fillet
“T”
“T”
Manny Banakis
APPROVED BY:
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