DF9-9S-1V(32) Hirose Electric Co Ltd, DF9-9S-1V(32) Datasheet - Page 8

• Manufacturer Part Number: DF9-9S-1V(32)
• Description: CONN RECEPT 9POS 1MM SMD TIN
• Manufacturer: Hirose Electric Co Ltd
• Series: DF9r

Specifications of DF9-9S-1V(32)

• Pitch: 0.039" (1.00mm)
• Number Of Rows: 2
• Connector Type: Receptacle, Outer Shroud Contacts
• Number Of Positions: 9
• Mounting Type: Surface Mount
• Features: Board Guide, Solder Retention
• Contact Finish: Tin
• Mated Stacking Heights: 4.3mm
• Height Above Board: 0.130" (3.30mm)
• Product Type: Receptacles
• Mounting Style: SMD/SMT
• Number Of Positions / Contacts: 9
• Contact Material: Phosphor Copper
• Contact Plating: Tin
• Voltage Rating: 150 V
• Current Rating: 0.5 A
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Contact Finish Thickness: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: H10397TR

A142
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
DF9 Series 1mm Pitch SMT Board to Board Connector(Standard Interface Connector Compliant with VESA FPDI-1)
BPrecautions for Use
1. Recommended Temperature Profile (SMT)
2. Recommended Manual Soldering Condition (SMT)
3. Recommended Screen Thickness (SMT)
4. Board Warp(SMT)
5. Cleaning Condition
6. Cautions
Note1: Up to 2 cycles of Reflow soldering are possible under the same conditions, provided that
Note2: The temperature profile indicates the board surface temperature at the point of contacts
Soldering iron temperature: 370 10 , Soldering time: Within 3 seconds
0.15mm
Maximum 0.03mm in the connector center area, based on both connector edges.
Refer to the "Nylon Connector Use Hand book".
Avoid retaining the board with the connector only, and fix the board by any other means than the connector.
Where the board is not mounted, the insertion or extraction will cause damage or deformation in contacts.
Excessive scoop insertion or extraction may result in damage.
In the manual soldering process, don't carry out flux coating which will cause a flux blister on the connector.
The color phase of this product may be slightly different from that of the forming product according to the
manufacturing lot. However, the difference doesn't affect the performance.
there is a return to normal temperature between the first and second cycle.
with the connector terminals.