VR68000001003JAC00 Vishay, VR68000001003JAC00 Datasheet - Page 4

• Manufacturer Part Number: VR68000001003JAC00
• Description: RES 100K OHM METAL FILM 1W 5%
• Manufacturer: Vishay
• Series: VR68r

Specifications of VR68000001003JAC00

• Resistance (ohms): 100K
• Power (watts): 1W
• Composition: Metal Film
• Features: Pulse Withstanding
• Temperature Coefficient: ±200ppm/°C
• Tolerance: ±5%
• Size / Dimension: 0.268" Dia x 0.748" L (6.80mm x 19.00mm)
• Lead Style: Through Hole
• Package / Case: Axial
• Resistance In Ohms: 100K
• Case: Axial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Height: -
• Other names: VR68J100KTB

Application Information
TESTS AND REQUIREMENTS
Essentially all tests are carried out in accordance with
IEC 60115-1 specification, category LCT/UCT/56 (rated
temperature range: Lower Category Temperature, Upper
Category Temperature; damp heat, steady state, test
duration: 56 days).
The tests are carried out in accordance with IEC 60068-2-xx.
Test method under standard atmospheric conditions
according to IEC 60068-1, 5.3.
Document Number: 28734
Revision: 09-Aug-10
Hot-spot temperature rise (ΔT) as a function of dissipated power
TEST PROCEDURES AND REQUIREMENTS
IEC
60115-1
CLAUSE
4.16
4.16.2
4.16.3
4.16.4
4.17
∆ T
(K)
80
60
40
20
0
0
METHOD
60068-2-
21 (Ua1)
21 (Ub)
21 (Uc)
20 (Ta)
TEST
IEC
0.4
Robustness of terminations:
Bending half number
Tensile all samples
Torsion other half
Solderability
Solderability
(after aging)
of samples
of samples
For technical questions, contact:
TEST
0.8
Metal Glaze Leaded Resistors
P (W)
High Ohmic/High Voltage
1.2
3 s; 245 °C: Solder bath method; SnAg3Cu0.5
for 3 s at 245 °C; solder bath (SnAg3Cu0.5)
2 s; 235 °C: Solder bath method; SnPb40
for 2 s at 235 °C; solder bath (SnPb40)
3 x 360° in opposite directions
Ø 0.8 mm; load 5 N; 4 x 90°
Ø 0.8 mm; load 10 N; 10 s
8 h steam or 16 h 155 °C;
[e-mail]
leads immersed 6 mm;
Temperature rise (ΔT) at the lead end (soldering point) as a function
In the Test Procedures and Requirements table the test
and requirements are listed with reference to the relevant
clauses of IEC 60115-1 and IEC 60068-2-xx test methods. A
short description of the test procedure is also given. In some
instances deviations from the IEC recommendations were
necessary for our method of specifying.
All soldering tests are performed with mildly activated flux.
PROCEDURE
of dissipated power at various lead lengths after mounting
∆ T
(K)
method
50
40
30
20
10
0
0
0.4
Vishay BCcomponents
Good tinning (≥ 95 % covered);
Good tinning (≥ 95 % covered);
ΔR max.: ± (0.5 % R + 0.05 Ω)
Number of failures < 10 x 10
Number of failures < 10 x 10
REQUIREMENTS
0.8
No damage
no damage
no damage
10 mm
P (W)
15 mm
www.vishay.com
VR68
1.2
211
-6
-6