BCR10001FMAHWT Vishay, BCR10001FMAHWT Datasheet

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BCR10001FMAHWT

Manufacturer Part Number
BCR10001FMAHWT
Description
RES 10K OHM 1/4W 1% BACK-C CHIP
Manufacturer
Vishay
Series
BCRr
Datasheet

Specifications of BCR10001FMAHWT

Resistance (ohms)
10K
Power (watts)
0.25W, 1/4W
Composition
Thin Film
Features
Moisture Resistant
Temperature Coefficient
±250ppm/°C
Tolerance
±1%
Size / Dimension
0.020" L x 0.020" W (0.51mm x 0.51mm)
Height
0.010" (0.25mm)
Lead Style
Surface Mount (SMD - SMT)
Package / Case
2020 (5050 Metric)
Resistance In Ohms
10.0K
Case
2020 (5050 metric)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
BCR10KFM
BCR
Vishay Electro-Films
The Back Contact Resistor (BCR) series single-value
back-contact resistor chip is one of the smallest chips available.
The BCR requires only one wire bond thus saving hybrid space.
The BCRs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology. The BCRs are 100 % electrically tested and
visually inspected to MIL-STD-883.
APPLICATIONS
Vishay EFI BCR resistor chips are widely used in hybrid packages where space is limited. The bottom connection is made by
attaching the back of the chip to the substrate either eutectically or with conductive epoxy. The single wire bond is made to the
notched pad on the top of the chip. (The other rectangular pad on the top of the chip is a via hole, a low-ohmic contact connecting
the resistor to the bottom of the chip.)
www.vishay.com
54
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-202, Method 308
100 Ω to 250 kΩ
< 100 Ω or > 251 kΩ
Moisture resistance, MIL-STD-202
Method 106
Stability, 1000 h, + 125 °C, 125 mW
Operating Temperature Range
Thermal Shock, MIL-STD-202,
Method 107, Test Condition F
High Temperature Exposure, + 150 °C, 100 h
Dielectric Voltage Breakdown
Insulation Resistance
Operating Voltage
DC Power Rating at + 70 °C (Derated to Zero at + 175 °C)
5 x Rated Power Short-Time Overload, + 25 °C, 5 s
10 Ω
Thin Film, Back-Contact Resistor
5 %
20 Ω 50 Ω
2 %
For technical questions, contact:
Product may not
be to scale
Tightest Standard Tolerance Available
1 %
100 Ω
0.5 %
200 Ω 1 kΩ
0.2 %
± 250 ppm/°C
± 100 ppm/°C
± 25 ppm/°C
± 50 ppm/°C
FEATURES
• Wire bondable
• Only one wire bond required
• Small size: 0.020 inches square
• Resistance range: 10 Ω to 1 MΩ
• Oxidized silicon substrate for good power dissipation
• Resistor material: Tantalum nitride, self-passivating
• Moisture resistant
efi@vishay.com
0.1 %
200 kΩ
360 kΩ
620 kΩ
± 0.25 % max. ΔR/R
± 0.25 % max. ΔR/R
± 0.5 % max. ΔR/R
± 1.0 % max. ΔR/R
- 55 °C to + 125 °C
± 0.5 % max. ΔR/R
1 MΩ
- 35 dB typ.
- 20 dB typ.
75 V max.
10
250 mW
200 V
12
min.
Document Number: 61023
Revision: 23-Jul-09

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BCR10001FMAHWT Summary of contents

Page 1

... MIL-STD-883. APPLICATIONS Vishay EFI BCR resistor chips are widely used in hybrid packages where space is limited. The bottom connection is made by attaching the back of the chip to the substrate either eutectically or with conductive epoxy. The single wire bond is made to the notched pad on the top of the chip. (The other rectangular pad on the top of the chip is a via hole, a low-ohmic contact connecting the resistor to the bottom of the chip ...

Page 2

... ± Gold ± Aluminum ± 100 ± 250 0/- 250 For technical questions, contact: efi@vishay.com BCR Vishay Electro-Films 0.020 0.016 0.020 TYPICAL RANGE 1.6 kΩ MΩ VISUAL CLASS (per MIL-STD-883, PACKAGING Method 2032 H = Class Waffle pack K = Class K 100 min ...

Page 3

... Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications their own risk and agree to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay or its distributor was negligent regarding the design or manufacture of the part ...

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