CN0603K14G EPCOS Inc, CN0603K14G Datasheet - Page 73

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CN0603K14G

Manufacturer Part Number
CN0603K14G
Description
VARISTOR 14VRMS 0603 SMD
Manufacturer
EPCOS Inc
Series
CN Standardr
Datasheets

Specifications of CN0603K14G

Varistor Voltage
22V
Current-surge
30A
Number Of Circuits
1
Maximum Ac Volts
14VAC
Maximum Dc Volts
18VDC
Energy
0.20J
Package / Case
0603 (1608 Metric)
Technology
Metal Oxide
Capacitance Value
100pF
Clamping Current
1A
Clamping Voltage
40V
Ac Voltage Rating (max)
14VAC
Dc Voltage Rating (max)
18VDC
Operating Temp Range
-55C to 85C
Mounting
Surface Mount
Surge Current (max)
30A
Size Code
0603
Product Length (mm)
1.6mm
Product Depth (mm)
0.8mm
Product Height (mm)
0.9mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
B72500V 140K 60
B72500V0140K060
B72500V140K60

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CN0603K14G
Manufacturer:
TDK-EPCOS
Quantity:
60 000
Note:
Leaching of the termination
Effective area at the termination might be lost if the soldering temperature and/or immersion time
are not kept within the recommended conditions. Leaching of the outer electrode should not ex-
ceed 25% of the chip end area (full length of the edge A-B-C-D) and 25% of the length A-B,
shown below as mounted on substrate.
As a single chip
7
7.1
7.2
Manual soldering with a soldering iron must be avoided, hot-air methods are recommended for
rework purposes.
7.3
All environmentally compatible agents are suitable for cleaning. Select the appropriate cleaning
solution according to the type of flux used. The temperature difference between the components
and cleaning liquid must not be greater than 100 C. Ultrasonic cleaning should be carried out
with the utmost caution. Too high ultrasonic power can impair the adhesive strength of the metal-
lized surfaces.
7.4
An excessive application of solder paste results in too high a solder fillet, thus making the chip
more susceptible to mechanical and thermal stress. Too little solder paste reduces the adhesive
strength on the outer electrodes and thus weakens the bonding to the PCB. The solder should be
applied smoothly to the end surface.
Please read Cautions and warnings and
Important notes at the end of this document.
Multilayer varistors (MLVs)
Standard series
According to JEDEC J-STD-020D. Please refer to chapter 2.
Notes for proper soldering
Preheating and cooling
Repair / rework
Cleaning
Solder paste printing (reflow soldering)
Page 73 of 81
As mounted on substrate

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