CT1206K30G EPCOS Inc, CT1206K30G Datasheet - Page 72
![VARISTOR 30VRMS 1206 SMD](/photos/1/40/14091/495-varistor_tvs_series_1206_sml.jpg)
CT1206K30G
Manufacturer Part Number
CT1206K30G
Description
VARISTOR 30VRMS 1206 SMD
Manufacturer
EPCOS Inc
Series
CT Automotiver
Datasheet
1.CT0402M4G.pdf
(81 pages)
Specifications of CT1206K30G
Varistor Voltage
47V
Current-surge
200A
Number Of Circuits
1
Maximum Ac Volts
30VAC
Maximum Dc Volts
38VDC
Energy
1.1J
Package / Case
1206 (3216 Metric)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
495-2602-2
B72520T 300K 62
B72520T0300K062
B72520T300K62
B72520T300K62V7
B72520T 300K 62
B72520T0300K062
B72520T300K62
B72520T300K62V7
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CT1206K30G
Manufacturer:
TDK
Quantity:
60 000
Company:
Part Number:
CT1206K30G
Manufacturer:
EPCOS Inc
Quantity:
77 810
A further advantage of adhesion is that the components are subjected to virtually no temperature
shock at all. The curing temperatures of the adhesives are between 120 C and 180 C, typical
curing times are between 30 minutes and one hour.
The bending strength of glued chips is, in comparison with that of soldered chips, higher by a fac-
tor of at least 2, as is to be expected due to the elasticity of the glued joints.
The lower conductivity of conductive adhesive may lead to higher contact resistance and thus re-
sult in electrical data different to those of soldered components. Users must pay special attention
to this in RF applications.
6
Test
Wettability
Leaching
resistance
Thermal shock
(solder shock)
Tests of resistance
to soldering heat
for SMDs
Tests of resistance
to soldering heat
for radial leaded
components
(SHCV)
Please read Cautions and warnings and
Important notes at the end of this document.
Multilayer varistors (MLVs)
Standard series
Solderability tests
Standard
IEC
60068-2-58
IEC
60068-2-58
IEC
60068-2-58
IEC
60068-2-20
Test conditions
Sn-Pb soldering
Immersion in
60/40 SnPb solder
using non-activated
flux at 215
for 3
Immersion in
60/40 SnPb
solder using
mildly activated flux
without preheating
at 260
for 10 1 s
Dip soldering at
300 C/5 s
Immersion in
60/40 SnPb for 10 s
at 260 C
Immersion
of leads in
60/40 SnPb
for 10 s at 260 C
0.3 s
5 C
Page 72 of 81
3 C
Test conditions
Pb-free soldering
Immersion in
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
at 245
for 3
Immersion in
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
without preheating
at 255
for 10 1 s
Dip soldering at
300 C/5 s
Immersion in
Sn96.5Ag3.0Cu0.5
for 10 s at 260 C
Immersion
of leads in
Sn96.5Ag3.0Cu0.5
for 10 s at 260 C
0.3 s
5 C
5 C
Criteria/ test results
Covering of 95% of
end termination,
checked by visual
inspection
No leaching of
contacts
No deterioration of
electrical parameters.
Capacitance change:
Change of varistor
voltage:
Change of varistor
voltage:
Change of
capacitance X7R:
15%
5%
5/+10%
5%