CT0603K14G EPCOS Inc, CT0603K14G Datasheet - Page 65

• Manufacturer Part Number: CT0603K14G
• Description: VARISTOR 14VRMS 0603 SMD
• Manufacturer: EPCOS Inc
• Series: CT Standardr

Specifications of CT0603K14G

• Energy: 0.20J
• Varistor Voltage: 22V
• Current-surge: 30A
• Number Of Circuits: 1
• Maximum Ac Volts: 14VAC
• Maximum Dc Volts: 18VDC
• Package / Case: 0603 (1608 Metric)
• Technology: Metal Oxide
• Capacitance Value: 100pF
• Clamping Current: 1A
• Clamping Voltage: 40V
• Ac Voltage Rating (max): 14VAC
• Dc Voltage Rating (max): 18VDC
• Operating Temp Range: -55C to 85C
• Mounting: Surface Mount
• Surge Current (max): 30A
• Size Code: 0603
• Product Length (mm): 1.6mm
• Product Depth (mm): 0.8mm
• Product Height (mm): 0.9mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 495-2593-2; B72500T 140K 60; B72500T0140K060; B72500T140K60; B72500T140K60V50; B72500T140K60V7

5
Attaching surface-mounted devices (SMDs) with electrically conductive adhesives is a commer-
cially attractive method of component connection to supplement or even replace conventional sol-
dering methods.
Electrically conductive adhesives consist of a non-conductive plastic (epoxy resin, polyimide or
silicon) in which electrically conductive metal particles (gold, silver, palladium, nickel, etc) are em-
bedded. Electrical conduction is effected by contact between the metal particles.
Adhesion is particularly suitable for meeting the demands of hybrid technology. The adhesives
can be deposited ready for production requirements by screen printing, stamping or by dis-
pensers. As shown in the following table, conductive adhesion involves two work operations fewer
than soldering.
Reflow soldering
Screen-print solder paste
Mount SMD
Predry solder paste
Reflow soldering
Wash
Inspect
A further advantage of adhesion is that the components are subjected to virtually no temperature
shock at all. The curing temperatures of the adhesives are between 120 C and 180 C, typical
curing times are between 30 minutes and one hour.
The bending strength of glued chips is, in comparison with that of soldered chips, higher by a fac-
tor of at least 2, as is to be expected due to the elasticity of the glued joints.
The lower conductivity of conductive adhesive may lead to higher contact resistance and thus re-
sult in electrical data different to those of soldered components. Users must pay special attention
to this in RF applications.
Please read Cautions and warnings and
Important notes at the end of this document.
Multilayer varistors (MLVs)
Standard series
Conductive adhesion
Wave soldering
Apply glue dot
Mount SMD
Cure glue
Wave soldering
Wash
Inspect
Page 65 of 75
Conductive adhesion
Screen-print conductive adhesive
Mount SMD
Cure adhesive
Inspect