CG0603MLC-3.3LE Bourns Inc., CG0603MLC-3.3LE Datasheet - Page 2

SUPPRESSOR ESD 3.3VDC 0603 SMD

CG0603MLC-3.3LE

Manufacturer Part Number
CG0603MLC-3.3LE
Description
SUPPRESSOR ESD 3.3VDC 0603 SMD
Manufacturer
Bourns Inc.
Series
ChipGuard® MLCr
Datasheet

Specifications of CG0603MLC-3.3LE

Package / Case
0603 (1608 Metric)
Number Of Circuits
1
Maximum Dc Volts
3.3VDC
Clamping Voltage
25 V
Current Rating
5 nA
Operating Voltage
3.3 V
Channels
1 Channel
Capacitance
0.5 pF
Termination Style
Solder Pad
Operating Temperature Range
- 40 C to + 85 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Energy
-
Current-surge
-
Maximum Ac Volts
-
Varistor Voltage
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
CG0603MLC-3.3LETR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CG0603MLC-3.3LE
Manufacturer:
BOURNS/伯恩斯
Quantity:
20 000
Part Number:
CG0603MLC-3.3LEA
Manufacturer:
BOURNS/伯恩斯
Quantity:
20 000
• This product can be damaged by rapid heating, cooling or localized heating.
• Heat shocks should be avoided. Preheating and gradual cooling recommended.
• Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
• Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds.
Product Dimensions
Solder Refl ow Recommendations
A solder gun under 30 watts is recommended.
300
250
200
150
100
50
0
ChipGuard
Dimension
W
A
B
L
Preheat Stages 1-3
110 sec. (min.)
L
®
MLC Series - ESD Protectors
(0.014 ± 0.002)
Time (seconds)
Soldering
(0.04 ± 0.006)
(0.02 ± 0.004)
(0.10 ± 0.006)
W
1.00 ± 0.15
0.50 ± 0.10
0.36 ± 0.05
0.25 ± 0.15
30-70
CG0402
sec.
Series
120 sec. (min.)
Cooling
B
(0.064 ± 0.008)
(0.032 ± 0.008)
(0.018 ± 0.004)
(0.012 ± 0.008)
1.60 ± 0.20
0.80 ± 0.20
0.45 ± 0.10
0.30 ± 0.20
A
CG0603
Series
C
D
A
B
E
DIMENSIONS:
Customers should verify actual device performance in their specifi c applications.
Stage 1 Preheat
Stage 2 Preheat
Stage 3 Preheat
Main Heating
Cooling
(INCHES)
MM
Ambient to Preheating
Temperature
140 °C to 160 °C
Preheat to 200 °C
200 °C
210 °C
220 °C
230 °C
240 °C
250 °C to 255 °C
200 °C to 100 °C
Recommended Pad Layout
Dim.
Specifi cations are subject to change without notice.
A
B
C
D
C
CG0402
(0.020)
(0.024)
(0.020)
(0.067)
Series
0.51
0.61
0.51
1.70
D
30 s to 60 s
60 s to 120 s
20 s to 40 s
60 s to 70 s
55 s to 65 s
50 s to 60 s
40 s to 50 s
30 s to 40 s
5 s
1 °C/s to 4 °C/s
CG0603
Series
(0.030)
(0.040)
(0.020)
(0.100)
0.76
1.02
0.50
2.54
A
B

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