MMT05B350T3G ON Semiconductor, MMT05B350T3G Datasheet
MMT05B350T3G
Specifications of MMT05B350T3G
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MMT05B350T3G Summary of contents
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... A(pk) TSM MMT05B350T3 "300 di/dt A/ms MMT05B350T3G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Preferred devices are recommended choices for future use and best overall value. ...
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THERMAL CHARACTERISTICS Characteristic Operating Temperature Range Blocking or Conducting State Overload Junction Temperature − Maximum Conducting State Only Maximum Lead Temperature for Soldering Purposes 1/8″ from Case for 10 Seconds ELECTRICAL CHARACTERISTICS Devices are bidirectional. All electrical parameters apply to ...
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V = 50V D1 10 1.0 0.1 0.01 0.001 −60 −40 − TEMPERATURE (°C) Figure 1. Typical Off−State Current versus Temperature 440 430 420 410 400 390 380 −60 −40 − ...
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MMT05B350T3 TIP GND OUTSIDE PLANT RING PPTC* TIP GND OUTSIDE PLANT RING PPTC* *Polymeric PTC (positive temperature coefficient) overcurrent protection device HEAT COIL TIP OUTSIDE GND PLANT RING HEAT COIL http://onsemi.com TELECOM EQUIPMENT TELECOM EQUIPMENT TELECOM EQUIPMENT 4 ...
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... *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “ ...