MCR03EZPFX8200 Rohm Semiconductor, MCR03EZPFX8200 Datasheet - Page 3
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MCR03EZPFX8200
Manufacturer Part Number
MCR03EZPFX8200
Description
RES 820 OHM 1/10W 1% 0603 SMD
Manufacturer
Rohm Semiconductor
Series
MCR03r
Datasheet
1.MCR03EZPJ472.pdf
(5 pages)
Specifications of MCR03EZPFX8200
Resistance (ohms)
820
Power (watts)
0.1W, 1/10W
Composition
Thick Film
Temperature Coefficient
±100ppm/°C
Tolerance
±1%
Size / Dimension
0.063" L x 0.031" W (1.60mm x 0.80mm)
Height
0.018" (0.45mm)
Lead Style
Surface Mount (SMD - SMT)
Package / Case
0603 (1608 Metric)
Resistance In Ohms
820
Case
0603 (1608 metric)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Other names
RHM820HTR
RHM820STR
RHM820STR
RHM820STR
RHM820STR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCR03EZPFX8200
Manufacturer:
ROHM
Quantity:
340 000
Dimensions (Unit : mm)
Packaging
○
MCR03
c
www.rohm.com
Reel
Bulk case
EIAJ ET-7200B compliamt
2010 ROHM Co., Ltd. All rights reserved.
A
B
Shutter
D
φ180
A
C
−3
0
0.3±0.2
0.3±0.2
φ60
B
+1
1.6±0.1
0
Slider
1
110±0.7
9
6
+1.0
C
5
Label
0
EIAJ ET-7200B compliant
(Unit : mm)
φ13 ± 0.2
12.0±0.1
36
−0.2
D
0
2
3
4
(Unit : mm)
Taping
Narrow pitch (2mm pitch) version
Thick paper
B
Thick paper
mount
0
mount
φ1.5
φ1.5
8.0±0.3
8.0±0.3
3/4
No.
D
D
W
W
1
2
3
4
5
6
+0.1
+0.1
0
0
Heat crimp cover Tape
0
0
Heat crimp cover Tape
Resistive element (Oxide metal thick film)
Silver thick film electrode
Nickel electrode
Sn electrode
Alumina substrate
Overcoating (Resin)
(Underside paper tape) Chip resistor
(Underside paper tape) Chip resistor Square punchout hole
3.5±0.05
3.5±0.05
4.0±0.1
4.0±0.1
P
P
P
P
F
F
2
2
0
0
P
A
0
A
0
P
0
0
P
1
1.75±0.1
1.75±0.1
P
4.0±0.1
2.0±0.5
1
Material
P
P
E
E
1
1
B
0
φD
φD
0
2.0±0.05
2.0±0.05
0
1.1±0.1
1.1±0.1
Square punchout hole
A
P
A
P
0
2
0
2
F
F
(Unit : mm)
(Unit : mm)
Max. 1.1
Max. 1.1
1.9±0.1
1.9±0.1
E
B
T
E
B
T
0
2
0
2
W
W
T
T
2
2
2010.11 - Rev.M
Data Sheet