RC0402JR-073KL Yageo, RC0402JR-073KL Datasheet - Page 8
![RES 3.0K OHM 1/16W 5% 0402 SMD](/photos/12/74/127461/crsm_rl0402_sml.jpg)
RC0402JR-073KL
Manufacturer Part Number
RC0402JR-073KL
Description
RES 3.0K OHM 1/16W 5% 0402 SMD
Manufacturer
Yageo
Series
RC0402r
Datasheets
1.YC248-JR-07100RL.pdf
(7 pages)
2.YC358TJK-071KL.pdf
(16 pages)
3.RC0402FR-073R3L.pdf
(9 pages)
Specifications of RC0402JR-073KL
Resistance (ohms)
3K
Power (watts)
0.063W, 1/16W
Composition
Thick Film
Temperature Coefficient
±100ppm/°C
Tolerance
±5%
Size / Dimension
0.039" L x 0.020" W (1.00mm x 0.50mm)
Height
0.014" (0.35mm)
Lead Style
Surface Mount (SMD - SMT)
Package / Case
0402 (1005 Metric)
Resistance In Ohms
3.00K
Case
0402 (1005 metric)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Other names
311-3.0KJRTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
RC0402JR-073KL
Manufacturer:
Yageo
Quantity:
20 000
TEST
Intermittent
Overload
Solderability
Jan 05, 2011 V.6
- Wetting
- Leaching
- Resistance to
Soldering Heat
Chip Resistor Surface Mount
TEST METHOD
IEC 60115-1 4.39
IPC/JEDEC J-STD-002B test B
IPC/JEDEC J-STD-002B test D
IEC 60068-2-58
1
2
Dipping time: 3±0.5 seconds
PROCEDURE
2.5 times of rated voltage or maximum
overload voltage whichever is less for 1 second
on and 25 seconds off; total 10,000 cycles
Electrical Test not required
Magnification 50X
SMD conditions:
Lead-free solder, 260 °C, 30 seconds
immersion time
Condition B, no pre-heat of samples
Lead-free solder, 260 °C, 10 seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
RC
st
nd
step: method B, aging 4 hours at 155 °C
step: lead-free solder bath at 245±3 °C
SERIES
dry heat
0402
±(1.0%+0.05 Ω) for 1% tol.
±(2.0%+0.05 Ω) for 5% tol.
<100 mΩ for Jumper
Well tinned (≥95% covered)
No visible damage
REQUIREMENTS
No visible damage
±(0.5%+0.05 Ω) for 1% tol.
±(1.0%+0.05 Ω) for 5% tol.
<50 mΩ for Jumper
No visible damage
Product specification
www.yageo.com
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