TNPW04021K00BEED Vishay, TNPW04021K00BEED Datasheet - Page 9
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TNPW04021K00BEED
Manufacturer Part Number
TNPW04021K00BEED
Description
RES 1.00K OHM 1/16W 0.1% 0402
Manufacturer
Vishay
Series
TNPWr
Datasheet
1.TNPW040220K0BEED.pdf
(10 pages)
Specifications of TNPW04021K00BEED
Temperature Coefficient
±25ppm/°C
Resistance (ohms)
1K
Power (watts)
0.063W, 1/16W
Composition
Thin Film
Tolerance
±0.1%
Size / Dimension
0.039" L x 0.020" W (1.00mm x 0.50mm)
Height
0.014" (0.35mm)
Lead Style
Surface Mount (SMD - SMT)
Package / Case
0402 (1005 Metric)
Resistance In Ohms
1.00K
Case
0402 (1005 metric)
Resistance
1kohm
Resistance Tolerance
± 0.1%
Power Rating
63mW
Voltage Rating
50V
Resistor Element Material
Thin Film
Resistor Case Style
0402
Operating Temperature Range
+ 155 C
Termination Style
SMD/SMT
Dimensions
0.5 mm W x 1 mm L x 0.35 mm H
Product
Precision Resistors Thin Film SMD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Details
Other names
TNP1.00KDATR
TNPW0402 1K 0.1% T9 ET7 E3
TNPW04021K00BEED
TNPW0402 1K 0.1% T9 ET7 E3
TNPW04021K00BEED
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TNPW04021K00BEED
Manufacturer:
VISHAY
Quantity:
600 000
Document Number: 28758
Revision: 30-Sep-08
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
4.17.2
4.18.2
4.29
4.32
4.33
4.7
4.35
APPLICABLE SPECIFICATIONS
• CECC40000/40400
• EN140400
• EN 140401-801
• EN 60115-1
• IEC 60286-3
-
TEST METHOD
IEC 60068-2
21 (Ue
21 (Ue
45 (XA)
58 (Td)
58 (Td)
-
-
-
3
1
)
)
soldering heat
Resistance to
Voltage proof
Flammability
For technical questions, contact: filmresistors.thinfilmchip@vishay.com
Solderability
Component
Damp heat
(adhesion)
resistance
Substrate
bending
solvent
Shear
TEST
High Stability Thin Film Flat Chip Resistor
≤ 0.05 % (1000 h rated power at 70 °C)
Stability for product types:
RR 1005M and RR 1608M;
RR 2012M and RR 3216M:
SnPb40; non-activated flux
Isopropyl alcohol + 50 °C;
SnAg3Cu0.5 or SnAg3.5;
(215 ± 3) °C; (3 ± 0.3) s
(235 ± 3) °C; (2 ± 0.2) s
(260 ± 5) °C; (10 ± 1) s
needle flame test; 10 s
Depth 2 mm, 3 times
Solder bath method;
Solder bath method;
Solder bath method;
U
(85 ± 5) °C; 56 days
non-activated flux
rms
IEC 60695-11-5,
PROCEDURE
(85 ± 5) % RH
= U
method 2
45 N
9 N
ins
; 60 ± 5 s
TNPW0402
TNPW0603
TNPW0805
TNPW1206
TNPW1210
TNPW2010
TNPW2512
no visible damage, no open circuit in bent position
Good tinning (≥ 95 % covered);
No flashover or breakdown
PERMISSIBLE CHANGE
± (0.02 % R + 0.01 Ω)
± (0.05 % R + 0.01 Ω)
No burning after 30 s
± (0.25 R + 0.05 Ω)
No visible damage
No visible damage
REQUIREMENTS
no visible damage
TNPW e3
www.vishay.com
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