NUP4304MR6T1 ON Semiconductor, NUP4304MR6T1 Datasheet

NUP4304MR6T1

Manufacturer Part Number

NUP4304MR6T1

Description

IC DIODE ARRAY LO CAP ESD SC74-6

Manufacturer

ON Semiconductor

Datasheet

1.NUP4304MR6T1G.pdf (6 pages)

Specifications of NUP4304MR6T1

Voltage - Breakdown

70V

Polarization

4 Channel Array - Bidirectional

Mounting Type

Surface Mount

Package / Case

SC-74-6

Applications

General Purpose

Number Of Circuits

Voltage - Working

70V

Technology

Diode Array

Product

Standard Recovery Rectifier

Configuration

Octal

Reverse Voltage

70 V

Forward Voltage Drop

1.25 V at 0.15 A

Forward Continuous Current

0.2 A

Max Surge Current

0.5 A

Reverse Current Ir

2.5 uA

Mounting Style

SMD/SMT

Maximum Operating Temperature

+ 85 C

Minimum Operating Temperature

- 40 C

Lead Free Status / RoHS Status

Contains lead / RoHS non-compliant

Power (watts)

Voltage - Clamping

Lead Free Status / Rohs Status

No RoHS Version Available

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

NUP4304MR6T1

Manufacturer:

Quantity:

1 300

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

NUP4304MR6T1G

Manufacturer:

Quantity:

6 000

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

NUP4304MR6T1G

Manufacturer:

Quantity:

30 000

Company:

Meier Automation Equipment Co., Limited

Part Number:

NUP4304MR6T1G

Manufacturer:

ON/安森美

Quantity:

20 000

Company:

H&T Electronics

Part Number:

NUP4304MR6T1G

Quantity:

4 500

Current page: 1 of 6
Download datasheet (136Kb)

NUP4304MR6

Low Capacitance Diode

Array for ESD Protection in

Four Data Lines

protection for sensitive components from possible harmful electrical

transients; for example, ESD (electrostatic discharge).

Features

•

Applications

•

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. FR−5 = 1.0 0.75 0.062 in.

MAXIMUM RATINGS

June, 2010 − Rev. 2

Reverse Voltage

Forward Current

Peak Forward Surge Current

Repetitive Peak Reverse Voltage

Average Rectified Forward

Repetitive Peak Forward Current

Non−Repetitive Peak Forward Current

NUP4304MR6 is a MicroIntegration™ device designed to provide

Low Capacitance (1.5 pF Maximum Between I/O Lines)

Single Package Integration Design

Provides ESD Protection for JEDEC Standards JESD22

Protection for IEC61000−4−2 (Level 4)

Ensures Data Line Speed and Integrity

Fewer Components and Less Board Space

Direct the Transient to Either Positive Side or to the Ground

USB 1.1 and 2.0 Data Line Protection

T1/E1 Secondary IC Protection

T3/E3 Secondary IC Protection

HDSL, IDSL Secondary IC Protection

Video Line Protection

Microcontroller Input Protection

Base Stations

Pb−Free Package is Available

Current (Note 1)

(averaged over any 20 ms period)

t = 1.0 ms

t = 1.0 S

C Bus Protection

Machine Model = Class C

Human Body Model = Class 3B

8.0 kV (Contact)

15 kV (Air)

Rating

(Each Diode) (T

= 25°C unless otherwise noted)

Symbol

FM(surge)

F(AV)

FRM

FSM

RRM

Value

200

500

715

450

2.0

1.0

0.5

mAdc

Unit

Vdc

†For information on tape and reel specifications,

NUP4304MR6T1

NUP4304MR6T1G

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

CASE 318F

TSOP−6

Device

1/O 3

I/O 1

(Note: Microdot may be in either location)

ORDERING INFORMATION

PIN CONFIGURATION

http://onsemi.com

AND SCHEMATIC

= Specific Device Code

= Date Code

= Pb−Free Package

(Pb−Free)

Package

TSOP−6

MARKING DIAGRAM

Publication Order Number:

LG MG

3000/Tape & Reel

NUP4304MR6/D

6 I/O

5 V

4 I/O

Shipping†

Related parts for NUP4304MR6T1

NUP4304MR6T1 Summary of contents

Page 1

... ORDERING INFORMATION Device Package Shipping† NUP4304MR6T1 TSOP−6 3000/Tape & Reel NUP4304MR6T1G TSOP−6 3000/Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. ...

Page 2

THERMAL CHARACTERISTICS Characteristic Thermal Resistance Junction−to−Ambient Lead Solder Temperature Maximum 10 Seconds Duration Junction Temperature Storage Temperature ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Reverse Breakdown Voltage (I = 100 mA) (BR) Reverse Voltage Leakage Current Capacitance (between I/O pins ...

Page 3

T = 85° 1 25°C A 0.1 0.2 0.4 0.6 0 FORWARD VOLTAGE (VOLTS) F Figure 1. Forward Voltage 1.75 1.5 1.25 1.0 0.75 0 Curves Applicable to Each Cathode 10 1.0 T ...

Page 4

The NUP4304MR6 is a low capacitance diode array designed to protect sensitive electronics such as communications systems, computers, and computer peripherals against damage due to ESD events or transient overvoltage conditions. Because of its low capacitance, it can be used ...

Page 5

Option 4 Protection of four data lines without biasing of the internal steering diodes. I I applications lacking a positive supply reference an external TVS diode may be used as ...

Page 6

... A1 0.7 0.028 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MicroIntegration is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein ...

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