SL05T1G ON Semiconductor, SL05T1G Datasheet - Page 5

• Manufacturer Part Number: SL05T1G
• Description: TVS LO CAP 300W 5V ESD SOT23
• Manufacturer: ON Semiconductor

Specifications of SL05T1G

• Voltage - Reverse Standoff (typ): 5V
• Voltage - Breakdown: 6V
• Power (watts): 300W
• Polarization: Bidirectional
• Mounting Type: Surface Mount
• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Applications: General Purpose
• Number Of Circuits: 1
• Voltage - Working: 5V
• Voltage - Clamping: 9.8V
• Technology: Diode Array
• Number Of Elements: 1
• Polarity: Uni-Directional
• Package Type: SOT-23
• Operating Temperature Classification: Military
• Reverse Breakdown Voltage: 6V
• Clamping Voltage: 11V
• Reverse Stand-off Voltage: 5V
• Leakage Current (max): 20uA
• Peak Pulse Current: 17A
• Peak Pulse Power Dissipation: 300W
• Test Current (it): 1mA
• Operating Temp Range: -55C to 150C
• Mounting: Surface Mount
• Pin Count: 3
• Operating Voltage: 5 V
• Breakdown Voltage: 6 V
• Termination Style: SMD/SMT
• Peak Surge Current: 17 A
• Capacitance: 3.5 pF
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 55 C
• Dimensions: 1.3 mm W x 2.9 mm L
• Rad Hardened: No
• Diode Type: Unidirectional TVS
• Power Dissipation Pd: 225mW
• Clamping Voltage Vc Max: 11V
• Diode Case Style: SOT-23
• No. Of Pins: 3
• Breakdown Voltage Min: 6V
• Breakdown Voltage Vbr: 9V
• Rohs Compliant: Yes
• Dc: 08+
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: SL05T1GOS; SL05T1GOS; SL05T1GOSTR

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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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A
A1
E
1
3
D
e
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
2
b
H
E
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SEE VIEW C
0.037
0.95
0.035
0.9
0.031
SOLDERING FOOTPRINT*
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
0.8
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
VIEW C
L1
http://onsemi.com
SOT−23 (TO−236)
L
CASE 318−08
ISSUE AN
q
0.25
5
c
SCALE 10:1
0.037
0.95
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
0.079
STYLE 26:
2.0
Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
STANDARD 318−08.
DIM
PIN 1. CATHODE
inches
A1
H
L1
A
b
D
E
c
e
L
mm
E
2. ANODE
3. NO CONNECTION
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
MILLIMETERS
NOM
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
1.00
0.06
0.44
0.13
2.90
1.30
1.90
0.20
0.54
2.40
MAX
0.10
0.50
0.18
3.04
1.40
2.04
0.30
0.69
2.64
1.11
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
MIN
INCHES
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
0.094
SL05T1/D
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
MAX