CS5201-3GSTR3 ON Semiconductor, CS5201-3GSTR3 Datasheet - Page 2

• Manufacturer Part Number: CS5201-3GSTR3
• Description: IC REG LINEAR 3.3V 1A SOT223
• Manufacturer: ON Semiconductor

Specifications of CS5201-3GSTR3

• Regulator Topology: Positive Fixed
• Voltage - Output: 3.3V
• Voltage - Input: Up to 7V
• Voltage - Dropout (typical): 1V @ 1A
• Number Of Regulators: 1
• Current - Output: 1A
• Current - Limit (min): 1A
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: SOT-223 (3 leads + Tab), SC-73, TO-261
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: CS5201-3GSTR3OS

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. 10 second maximum.
2. 60 second maximum above 183°C.
3. Load regulation and output voltage are measured at a constant junction temperature by low duty cycle pulse testing. Changes in output
4. Specifications apply for an external Kelvin sense connection at a point on the output pin 1/4” from the bottom of the package.
5. Dropout voltage is a measurement of the minimum input/output differential at full load.
6. Guaranteed by design, not 100% tested in production.
7. Thermal shutdown is 100% functionally tested in production.
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
T
PACKAGE PIN DESCRIPTION
Fixed Output Voltage
TO−220−3
J
Supply Voltage, V
Operating Temperature Range
Junction Temperature
Storage Temperature Range
Lead Temperature Soldering:
ESD Damage Threshold (Human Body Model)
Reference Voltage (Notes 3 and 4)
Line Regulation
Load Regulation (Notes 3 and 4)
Dropout Voltage (Note 5)
Current Limit
Quiescent Current
Thermal Regulation (Note 6)
Ripple Rejection (Note 6)
Thermal Shutdown (Note 7)
Thermal Shutdown Hysteresis (Note 7)
≤ +150°C, unless otherwise specified, I
voltage due to temperature changes must be taken into account separately.
1
2
3
Package Pin Number
Characteristic
D
2
PAK−3
1
2
3
IN
SOT−223
1
2
3
Pin Symbol
(C
full load
V
GND
IN
V
0 ≤ I
2.0 V ≤ V
V
I
V
I
30 ms Pulse, T
f = 120 Hz; I
V
OUT
OUT
OUT
IN
IN
IN
IN
V
= 10 mF, C
RIPPLE
− V
− V
− V
OUT
= 1.0 A)
= 1.0 A
= 10 mA
Parameter
OUT
OUT
OUT
≤ 1.0 A
IN
= 1.0 V
Ground connection.
Regulated output voltage (case).
Input voltage.
= 1.5 V;
− V
= 2.0 V; 10 mA ≤ I
= 3.0 V
OUT
OUT
http://onsemi.com
Test Conditions
A
OUT
= 25°C
= 1.0 A; V
= 22 mF Tantalum, V
PP
≤ 3.7 V; I
Wave Solder (through hole styles only) (Note 1)
−
−
2
IN
OUT
− V
OUT
OUT
= 10 mA
Reflow (SMD styles only) (Note 2)
≤ 1.0 A
= 3.0 V;
OUT
+ V
DROPOUT
Function
(−1.5%)
3.250
Min
150
1.0
−
−
−
−
−
−
−
< V
IN
< 7.0 V, 0°C ≤ T
3.300
0.002
0.02
0.04
Typ
180
1.0
3.1
5.0
80
25
−60 to +150
−40 to +70
260 Peak
230 Peak
(+1.5%)
Value
3.350
0.020
150
7.0
2.0
Max
0.20
210
0.4
1.2
10
A
−
−
−
≤ 70°C,
%/W
Unit
mA
Unit
dB
°C
°C
%
%
V
V
A
°C
°C
°C
°C
°C
kV
V