SP3003-02XTG Littelfuse Inc, SP3003-02XTG Datasheet - Page 6

• Manufacturer Part Number: SP3003-02XTG
• Description: TVS ARRAY ESD 2CH 0.65PF SOT553
• Manufacturer: Littelfuse Inc
• Series: SPA SP3003r

Specifications of SP3003-02XTG

• Package / Case: SOT-553-5
• Voltage - Reverse Standoff (typ): 6V
• Polarization: 2 Channel Array - Bidirectional
• Mounting Type: Surface Mount
• Applications: General Purpose
• Number Of Circuits: 2
• Voltage - Working: 5V
• Technology: Diode Array
• Polarity: Unidirectional
• Clamping Voltage: 15 V
• Operating Voltage: 6 V
• Breakdown Voltage: 6 V
• Peak Surge Current: 2.5 A
• Capacitance: 0.65 pF
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Dimensions: 1.35 (Max) mm W x 2.25 (Max) mm L x 1 (Max) mm H
• No. Of Pins: 5
• Clamping Voltage Vc Max: 11.8V
• Diode Case Style: SOT-553
• Filter Terminals: SMD
• Breakdown Voltage Min: 6V
• No. Of Lines Protected Max: 2
• Operating Temperature Range: -40°C To +85°C
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -
• Voltage - Clamping: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: F3302TR; SP3003-02XTG

SP3003 Lead-Free/Green Series
Package Dimensions — SOT563
Package Dimensions — MSOP10
Part Numbering System
Part Marking System
Number of Channels
Silicon
Protection
Array
Series
-02 = 2 channel
-04 = 4 channel
XXX
6
(SC70-5, SOT553 packages)
(SC70-6, SOT563, MSOP-10 packages)
e
D
2
5
B
3
4
SP3003-04 X T G
Product Series
(varies) F, H or P =
SP3003 series
E
SPA™ Silicon Protection Array Products
A
Assembly Site
X X X
(varies)
Package
A = MSOP-10, 3000 quantity
J = SC70-5 or SC70-6, 3000 quantity
X = SOT553 or SOT563, 5000 quantity
c
HE
L
G= Green
T= Tape & Reel
Number of Channels
Low Capacitance ESD Protection Array
Solder Pad Layout
(varies) 2 or 4
Solder Pad Layout
Revised: August 19, 2010
70
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to JEDEC SPEC MO-223 Issue A
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
Product Characteristics
Lead Plating
Lead Material
Lead Coplanarity
Subsitute Material
Body Material
Flammability
P
P
a
a
P
P
k c
k c
HE
HE
A1
E1
n i
A
D
n i
A
D
B
E
e
L
B
E
e
c
c
a
a
s
s
g
g
e
e
0.50
0.08
0.00
0.08
2.90
4.67
2.90
0.40
Min
0.17
1.50
0.10
1.50
Min
0.17
1.10
-
Millimeters
Millimeters
0.50 BSC
0.50 BSC
Please refer to http://www.littelfuse.com for current information.
Matte Tin (SC70-x, MSOP-10),
Pre-Plated Frame (SOT5x3)
Copper Alloy
0.0004 inches (0.102mm)
Silicon
Molded Epoxy
UL94-V-0
Specifications are subject to change without notice.
Max
Max
0.60
0.27
0.18
0.30
0.15
0.27
0.23
3.10
5.10
3.10
0.80
1.70
1.30
1.70
1.10
M
S
O
S
T
1
O
6
0
563
P
1
0
0.020
0.007
0.003
0.059
0.043
0.004
0.059
0.000
0.007
0.003
0.114
0.184
0.114
0.016
Min
Min
-
0.020 BSC
0.020 BSC
Inches
Inches
©2010 Littelfuse, Inc.
0.007
0.006
0.009
0.200
0.024
0.067
0.051
0.012
0.067
0.043
0.122
0.122
0.031
0.011
0.011
Max
Max