MIC5209-2.5BM Micrel Inc, MIC5209-2.5BM Datasheet - Page 11
![IC REG LDO 500MA 1% 2.5V 8-SOIC](/photos/6/50/65078/576-8-soic_sml.jpg)
MIC5209-2.5BM
Manufacturer Part Number
MIC5209-2.5BM
Description
IC REG LDO 500MA 1% 2.5V 8-SOIC
Manufacturer
Micrel Inc
Datasheet
1.MIC5209-3.3YS_TR.pdf
(13 pages)
Specifications of MIC5209-2.5BM
Regulator Topology
Positive Fixed
Voltage - Output
2.5V
Voltage - Input
Up to 16V
Voltage - Dropout (typical)
0.35V @ 500mA
Number Of Regulators
1
Current - Output
500mA
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Current - Limit (min)
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MIC5209-2.5BM
Manufacturer:
MICREL
Quantity:
29
Part Number:
MIC5209-2.5BM
Manufacturer:
MITEL
Quantity:
20 000
Considering worst case tolerances, the power dissipation
could be as high as:
Using the maximum junction temperature of 125°C and a θ
of 8°C/W for the SOT-223, 25°C/W for the SO-8, or 2°C/W
for the TO-263 package, the following worst-case heat-sink
thermal resistance (θ
Table 2 and Figure 6 show that the Slot-1 power supply ap-
plication can be implemented with a minimum footprint layout.
June 2006
T
T
T
T
θ
θ
θ
θ
A
A
A
A
JA
SA
SA
SA
SA
SA
SA
SA
SA
SA
Table 2. Maximum Allowable Thermal Resistance
(limit)
(limit)
SOT-223
SOT-223
SOT-223
SO-8
SO-8
SO-8
TO-263-5
TO-263-5
TO-263-5
(V
[(3.6V – 2.375V) × 320mA] + (3.6V × 4mA)
P
θ
θ
SA
SA
SA
D
JA
IN(max)
= 407mW
= θ
= θ
=
JA
JA
JA
T
T
– V
J(max)
J(max
J(max
= θ
= θ
209°C/W
209°C/W
201°C/W
201°C/W
201°C/W
184°C/W
184°C/W
184°C/W
207°C/W
207°C/W
207°C/W
40°C
40°C
40°C
OUT(max)
JC
P
P
D
D
D
SA
−
) requirements are:
T
T
A
A
A
) × I
184°C/W
184°C/W
176°C/W
176°C/W
176°C/W
159°C/W
159°C/W
159°C/W
182°C/W
182°C/W
182°C/W
50°C
50°C
50°C
OUT
+ V
160°C/W
160°C/W
152°C/W
152°C/W
152°C/W
135°C/W
135°C/W
135°C/W
158°C/W
158°C/W
158°C/W
IN(max)
60°C
60°C
60°C
× I
GND
123°C/W
123°C/W
121°C/W
121°C/W
121°C/W
115°C/W
115°C/W
115°C/W
98°C/W
98°C/W
98°C/W
75°C
75°C
75°C
JC
11
Figure 6 shows the necessary copper pad area to obtain
specifi c heat sink thermal resistance (θ
values in Table 2 require much less than 500mm
according to Figure 6, and can easily be accomplished with
the minimum footprint.
Figure 6. PCB Heat Sink Thermal Resistance
70
60
50
40
30
20
10
0
0
COPPER HEAT SINK AREA (mm
COPPER HEAT SINK AREA (mm
COPPER HEAT SINK AREA (mm )
2000
4000
SA
) values. The θ
6000
2
2
M9999-060906
2
of copper,
SA