P850-G200-WH Bourns Inc., P850-G200-WH Datasheet - Page 4

• Manufacturer Part Number: P850-G200-WH
• Description: SURGE SUPP TBU 200MA 850VIMP SMD
• Manufacturer: Bourns Inc.
• Series: TBU™r

Specifications of P850-G200-WH

• Voltage - Working: 425V
• Technology: Mixed Technology
• Number Of Circuits: 2
• Applications: SLIC
• Package / Case: 0.325" L x 0.157 " W x 0.033" H (8.25mm x 4mm x 0.85mm)
• Voltage Rating: 850 V
• Current Rating: 200 mA
• Height: 0.85 mm
• Length: 8.25 mm
• Mounting: SMD/SMT
• Operating Temperature Range: - 40 C to + 85 C
• Termination Style: SMD/SMT
• Width: 4 mm
• Suppressor Type: Data Line / Mains
• Output Current: 400mA
• Peak Surge Current: 200mA
• Response Time: 1µs
• Resistance: 55ohm
• Operating Temperature Max: 85°C
• Clamping Voltage Vc Max: 850V
• Length/height, External: 0.85mm
• Rohs Compliant: Yes
• External Depth: 4mm
• External Width: 8.25mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -
• Voltage - Clamping: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

P500-Gxxx
P850-Gxxx
Pads 1A and 1 are internally connected; the same for pads 3A with 3, 4A with 4, and 6A with 6.
This allows for one PCB layout to accommodate the P500 or P850.
P500-Gxxx
P850-Gxxx
TBU
defi ne (NSMD). Recommended stencil thickness is 0.10-0.12 mm (.004-.005 in.) with stencil
opening size 0.025 mm (.0010 in.) less than the device pad size. As when heat sinking any power
device, it is recommended that, wherever possible, extra PCB copper area is allowed. For mini-
mum parasitic capacitance, do not allow any signal, ground or power signals beneath any of the
pads of the device.
A
Product Dimensions
Recommended Pad Layout
(.048)
1.225
(.048)
1.225
®
TBU
devices have matte-tin termination fi nish. Suggested layout should use non-solder mask
(.015)
0.375
A
(.033)
(.015)
0.375
0.85
(.050)
1.275
(.012)
0.30
PIN 1
®
(.030)
0.75
P500-G and P850-G Protectors
TOP VIEW
TOP VIEW
PIN 1
B
B
(.049)
1.25
(.030)
0.75
(.045)
1.15
(.045)
1.15
C
C
SIDE VIEW
SIDE VIEW
D
D
J
J
G
K
4A
3A
4
3
E
NC = Solder to PCB; do not make electrical
connection, do not connect to ground.
NC = Solder to PCB; do not make electrical
connection, do not connect to ground.
4
3
L
BOTTOM VIEW
Pad #
E
BOTTOM VIEW
1A
3A
1
2
3
K
5
2
K
5
2
F
Pad #
Tip Out
Tip Out
J
F
6
1
Pad Designation
Apply
1
2
3
4
5
6
E
Tip In
Tip In
Pad Designation
NC
K
6
1
L
E
H
M
6A
1A
N
N
Ring Out
Tip Out
Ring In
G
Apply
Tip In
Pad #
H H
NC
NC
4A
6A
J
4
5
6
M
N
N
Customers should verify actual device performance in their specifi c applications.
Ring Out
Ring Out
Ring In
Ring In
Apply
NC
Dim.
M
B
C
D
G
H
K
N
A
E
F
J
L
P500-Gxxx
P850-Gxxx
(.139)
(.232)
(.031)
0.000
(.000)
(.045)
(.041)
(.043)
0.375
(.015)
(.028)
(.028)
0.375
(.015)
Min.
5.90
0.80
1.15
1.05
1.10
0.70
0.70
Block Diagram
3.40
Specifi cations are subject to change without notice.
--
--
P500-G
6 & 6A
1 & 1A
DIMENSIONS:
(.157)
(.236)
(.033)
0.025
(.001)
(.049)
(.045)
(.047)
0.425
(.017)
(.030)
(.030)
0.425
(.017)
Typ.
4.00
1.25
1.15
1.20
0.75
0.75
6
6.00
0.85
1
--
--
0.050
0.475
0.475
(.161)
(.240)
(.035)
(.002)
(.053)
(.049)
(.051)
(.019)
(.031)
(.031)
(.018)
Max.
4.10
6.10
0.90
1.35
1.25
1.30
0.80
0.80
--
--
(INCHES)
(.139)
(.321)
(.031)
0.000
(.000)
(.045)
(.041)
0.725
(.029)
(.043)
0.375
(.015)
(.010)
(.028)
(.028)
0.375
(.015)
Min.
3.40
8.15
0.80
1.15
1.05
1.10
0.25
0.70
0.70
MM
P850-G
0.025
0.825
0.425
0.425
(.157)
(.325)
(.033)
(.001)
(.049)
(.045)
(.032)
(.047)
(.017)
(.012)
(.030)
(.030)
(.017)
Typ.
4.00
8.25
0.85
1.25
1.15
1.20
0.30
0.75
0.75
3 & 3A
4 & 4A
4
3
(.161)
(.329)
(.035)
0.050
(.002)
(.053)
(.049)
0.925
(.036)
(.051)
0.475
(.019)
(.014)
(.031)
(.031)
0.475
(.018)
Max.
4.10
8.35
0.90
1.35
1.25
1.30
0.35
0.80
0.80