P850-U180-WH Bourns Inc., P850-U180-WH Datasheet - Page 4

• Manufacturer Part Number: P850-U180-WH
• Description: SURGE SUP TBU ETH 180MA 850VIMP
• Manufacturer: Bourns Inc.
• Series: TBU™r

Specifications of P850-U180-WH

• Voltage - Working: 425V
• Technology: Mixed Technology
• Number Of Circuits: 2
• Applications: Ethernet
• Package / Case: 0.305" L x 0.246" W x 0.033" H (7.75mm x 6.25mm x 0.85mm)
• Voltage Rating: 850 V
• Current Rating: 180 mA
• Height: 0.85 mm
• Length: 7.75 mm
• Mounting: SMD/SMT
• Operating Temperature Range: - 40 C to + 85 C
• Termination Style: SMD/SMT
• Width: 6.25 mm
• Suppressor Type: Data Line / Mains
• Output Current: 360mA
• Peak Surge Current: 180mA
• Response Time: 1µs
• Resistance: 8ohm
• Operating Temperature Max: 85°C
• Clamping Voltage Vc Max: 850V
• Length/height, External: 0.85mm
• Rohs Compliant: Yes
• External Depth: 6.25mm
• External Width: 7.75mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -
• Voltage - Clamping: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

TBU
defi ne (NSMD). Recommended stencil thickness is 0.10-0.12 mm (.004-.005 in.) with stencil
opening size 0.025 mm (.0010 in.) less than the device pad size. As when heat sinking any power
device, it is recommended that, wherever possible, extra PCB copper area is allowed. For mini-
mum parasitic capacitance, do not allow any signal, ground or power signals beneath any of the
pads of the device.
Profi le Feature
Average Ramp-Up Rate (Tsmax to Tp)
Preheat
Time maintained above:
Peak/Classifi cation Temperature (Tp)
Time within 5 °C of Actual Peak Temp. (tp)
Ramp-Down Rate
Time 25 °C to Peak Temperature
(.099)
2.525
Product Dimensions
Recommended Pad Layout
Thermal Resistances
Refl ow Profi le
Symbol
- Temperature Min. (Tsmin)
- Temperature Max. (Tsmax)
- Time (tsmin to tsmax)
- Temperature (TL)
- Time (tL)
R
®
TBU
th(j-a)
devices have matte-tin termination fi nish. Suggested layout should use non-solder mask
A
(.023)
(.015)
0.575
0.375
(.020)
0.50
®
Parameter
Junction to leads (package)
Junction to leads (per TBU
P650-U and P850-U Protectors
TOP VIEW
PIN 1
B
(.049)
1.25
(.028)
0.70
(.168)
4.275
C
SIDE VIEW
D
®
device)
J
Pb-Free Assembly
3 °C/sec. max.
150 °C
200 °C
60-180 sec.
217 °C
60-150 sec.
260 °C
20-40 sec.
6 °C/sec. max.
8 min. max.
E
NC = Solder to PCB; do not make electrical
connection, do not connect to ground.
4
3
L
5
2
BOTTOM VIEW
K
Pad #
F
Pad Designation
1
2
3
4
5
6
Value
202
105
6
1
G
Apply
Out1
Out2
J
NC
NC
In1
In2
H
H
Customers should verify actual device performance in their specifi c applications.
N
N
°C/W
°C/W
Unit
P
Block Diagram
Dim.
Specifi cations are subject to change without notice.
B
C
D
G
H
K
N
Q
A
E
F
J
L
P
Line
Side
DIMENSIONS:
0.000
(.242)
(.301)
(.031)
(.000)
(.020)
(.047)
(.165)
(.096)
(.008)
(.018)
(.026)
(.008)
(.028)
(.126)
1
6
Min.
7.65
0.80
1.20
4.20
2.45
0.20
0.45
0.65
0.20
0.70
3.20
6.15
0.50
TBU
®
Device
(INCHES)
(.246)
(.305)
(.033)
0.025
(.001)
(.022)
(.049)
(.167)
(.098)
(.010)
(.020)
(.028)
(.010)
(.030)
(.128)
Typ.
6.25
0.55
1.25
4.25
2.50
0.25
0.50
0.70
0.25
0.75
3.25
7.75
0.85
MM
3
4
Load
Side
0.050
(.250)
(.309)
(.035)
(.002)
(.024)
(.051)
(.169)
(.100)
(.012)
(.022)
(.030)
(.012)
(.031)
(.130)
Max.
6.35
7.85
0.90
0.60
1.30
4.30
2.55
0.30
0.55
0.75
0.30
0.80
3.30