P40-G240-WH Bourns Inc., P40-G240-WH Datasheet - Page 4

• Manufacturer Part Number: P40-G240-WH
• Description: SURGE SUPP TBU 240MA 40VIMP SMD
• Manufacturer: Bourns Inc.
• Series: TBU™r

Specifications of P40-G240-WH

• Voltage - Working: 28V
• Technology: Mixed Technology
• Number Of Circuits: 2
• Applications: General Purpose
• Package / Case: 0.157" L x 0.157" W x 0.033" H (4.00mm x 4.00mm x 0.85mm)
• Voltage Rating: 40 V
• Current Rating: 240 mA
• Height: 0.85 mm
• Length: 4 mm
• Mounting: SMD/SMT
• Operating Temperature Range: - 40 C to + 85 C
• Termination Style: SMD/SMT
• Width: 4 mm
• Suppressor Type: Data Line / Mains
• Output Current: 480mA
• Peak Surge Current: 240mA
• Response Time: 200ns
• Resistance: 3.6ohm
• Operating Temperature Max: 85°C
• Clamping Voltage Vc Max: 40V
• Length/height, External: 0.85mm
• Rohs Compliant: Yes
• External Depth: 4mm
• External Width: 4mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -
• Voltage - Clamping: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

TBU
mask defi ne (NSMD). Recommended stencil thickness is 0.10-0.12 mm (.004-.005 in.) with
stencil opening size 0.025 mm (.0010 in.) less than the device pad size. As when heat sink-
ing any power device, it is recommended that, wherever possible, extra PCB copper area is
allowed. For minimum parasitic capacitance, do not allow any signal, ground or power
signals beneath any of the pads of the device.
Thermal resistance using minimal pad size, where the power is the total power dissipated in the package. Additional copper pad area to be
used for additional heatsinking is also recommended.
Thermal Resistances
Product Dimensions
Recommended Pad Layout
Symbol
A
R
R
®
TBU
th(j-a)
th(j-a)
devices have matte-tin termination fi nish. Suggested layout should use non-solder
(.035)
(.014)
0.90
(.012)
0.35
0.30
®
TOP VIEW
P40-G Protectors
Parameter
Junction to Package Pads (1 TBU of Pair)
Junction to Package Pads (2 TBUs of Equal Power)
PIN 1
B
(.012 +.002/-.000)
0.30 +0.05/-0.00
(.102)
2.60
C
SIDE VIEW
D
(.057)
1.45
NC = Solder to PCB; do not make electrical
connection, do not connect to ground.
F
G
G
K
4
3
Pad #
J
1
2
3
4
5
6
BOTTOM VIEW
Pad Designation
5
2
E
K
J
6
1
Apply
Out1
Out2
Customers should verify actual device performance in their specifi c applications.
In1
NC
NC
In2
H
H
F
M
N
N
Block Diagram
Dim.
Specifi cations are subject to change without notice.
G
M
A
B
C
D
E
H
K
N
F
J
DIMENSIONS:
Value
(.154)
(.154)
(.031)
0.000
(.000)
(.100)
(.008)
(.030)
(.055)
(.004)
(.010)
(.022)
(.008)
6
1
Min.
3.90
0.80
0.20
0.75
1.40
0.10
0.25
0.55
0.20
3.90
2.55
180
250
TBU™ Device
0.025
(.157)
(.157)
(.033)
(.001)
(.102)
(.010)
(.031)
(.057)
(.006)
(.012)
(.024)
(.010)
(INCHES)
Typ.
4.00
0.85
2.60
0.25
0.80
1.45
0.15
0.30
0.60
0.25
4.00
MM
4
3
°C/W
°C/W
Unit
(.161)
(.161)
(.035)
0.050
(.002)
(.104)
(.012)
(.033)
(.059)
(.008)
(.014)
(.026)
(.012)
Max.
4.10
4.10
0.90
2.65
0.30
0.85
1.50
0.20
0.35
0.65
0.30