NCP3335ADM330R2G ON Semiconductor, NCP3335ADM330R2G Datasheet - Page 4

• Manufacturer Part Number: NCP3335ADM330R2G
• Description: IC REG LDO 500MA 3.3V MICRO8
• Manufacturer: ON Semiconductor

Specifications of NCP3335ADM330R2G

• Regulator Topology: Positive Fixed
• Voltage - Output: 3.3V
• Voltage - Input: Up to 12V
• Number Of Regulators: 1
• Current - Output: 500mA (Min)
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
• Number Of Outputs: 1
• Polarity: Positive
• Input Voltage Max: 16 V
• Output Voltage: 3.3 V
• Output Type: Fixed
• Dropout Voltage (max): 0.34 V at 500 mA
• Output Current: 0.8 A
• Line Regulation: 0.04 mV / V
• Load Regulation: 0.04 mV / mA
• Voltage Regulation Accuracy: 0.9 %
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Dropout (typical): -
• Current - Limit (min): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: NCP3335ADM330R2G; NCP3335ADM330R2GOSTR

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE:
*Which ever is less. Reverse bias protection feature valid only if V
1. As mounted on a 35 x 35 x 1.5 mm FR4 Substrate, with a single layer of a specified copper area of 2 oz (0.07 mm thick) copper traces and
PIN FUNCTION DESCRIPTION
Fixed Version
Adjustable Version
MAXIMUM RATINGS
THERMAL CHARACTERISTICS
Micro 8
10 Lead DFN EPad
Input Voltage
Output Voltage
Shutdown Pin Voltage
Junction Temperature Range
Storage Temperature Range
Junction-to-Air , qJA
Junction-to-Pin, yJL2
Junction-to-Air , qJA
Junction-to-Pin, yJL2
Pin No.
Micro8
heat spreading area. JEDEC 51 specifications for a low and high conductivity test board recommend a 2 oz copper thickness. Test conditions
are under natural convection or zero air flow.
1, 2
7, 8
1, 2
7, 8
3
4
5
6
-
-
3
4
5
6
-
-
This device series contains ESD protection and exceeds the following tests:
Human Body Model (HBM) JESD 22-A114-B
Machine Model (MM) JESD 22-A115-A
Pin No.
Characteristic
DFN10
EPAD
EPAD
9, 10
9, 10
1, 2
5, 6
1, 2
5, 6
3
4
7
8
3
4
7
8
Pin Name
SENSE
EPAD
EPAD
GND
GND
V
V
NR
SD
NC
Adj
NR
SD
NC
V
V
out
out
in
in
Rating
Regulated output voltage. Bypass to ground with C
For output voltage sensing, connect to Pins 1 and 2.
Power Supply Ground
Noise Reduction Pin. This is an optional pin used to further reduce noise.
Shutdown pin. When not in use, this pin should be connected to the input pin.
Power Supply Input Voltage
Not Connected
Exposed thermal pad should be connected to ground.
Regulated output voltage. Bypass to ground with C
Adjustable pin; reference voltage = 1.25 V.
Power Supply Ground
Noise Reduction Pin. This is an optional pin used to further reduce noise.
Shutdown pin. When not in use, this pin should be connected to the input pin.
Power Supply Input Voltage
Not Connected
Exposed thermal pad should be connected to ground.
Min Pad Board (Note 1)
http://onsemi.com
NCP3335A
264
110
215
55
out
4
- V
Test Conditions (Typical Value)
in
≤ 7 V.
Symbol
V
V
T
Description
V
T
out
stg
sh
in
J
out
out
1, Pad Board (Note 1)
-0.3 to V
w 1.0 mF.
w 1.0 mF.
-40 to +150
-50 to +150
-0.3 to +16
-0.3 to +16
174
100
in
Value
66
17
+0.3 or 10 V*
Unit
°C
°C
°C/W
°C/W
°C/W
°C/W
V
V
V
Unit