NCP623MN-30R2G ON Semiconductor, NCP623MN-30R2G Datasheet - Page 16

• Manufacturer Part Number: NCP623MN-30R2G
• Description: IC REG LDO 150MA 3.0V 6-DFN
• Manufacturer: ON Semiconductor

Specifications of NCP623MN-30R2G

• Regulator Topology: Positive Fixed
• Voltage - Output: 3V
• Voltage - Input: Up to 12V
• Voltage - Dropout (typical): 0.18V @ 150mA
• Number Of Regulators: 1
• Current - Output: 150mA
• Current - Limit (min): 175mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 6-VFDFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PUBLICATION ORDERING INFORMATION
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2X
SEATING
PLANE
0.10
0.08
REFERENCE
2X
0.15
PIN ONE
6X
C
C
6X
L
0.15
C
A1
K
C
BOTTOM VIEW
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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TOP VIEW
SIDE VIEW
6
1
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DETAIL B
D2
D
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3
4
(A3)
e
6X
b
0.10 C
0.05 C
E2
B
A
E
NOTE 3
A
DETAIL A
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
C
A B
6 PIN DFN, 3x3x0.9
A1
http://onsemi.com
CASE 488AE−01
MOLD COMPOUND
ISSUE B
16
L1
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BOTTOM VIEW
SIDE VIEW
DETAIL B
EDGE OF PACKAGE
*For additional information on our Pb−Free strategy and soldering
DETAIL A
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Ç Ç Ç
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EXPOSED Cu
0.130
3.31
0.025
0.63
(A3)
SOLDERING FOOTPRINT*
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NOTES:
1. DIMENSIONS AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. TERMINAL b MAY HAVE MOLD COMPOUND
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
MATERIAL ALONG SIDE EDGE. MOLD
FLASHING MAY NOT EXCEED 30 MICRONS
ONTO BOTTOM SURFACE OF TERMINAL b.
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DIM
A1
A3
D2
E2
L1
A
b
D
E
K
L
e
0.964
2.45
Ç Ç
Ç Ç
Ç Ç
Ç Ç
MILLIMETERS
0.80
0.00
0.20
0.18
2.25
1.55
0.20
0.30
0.00
MIN
3.00 BSC
3.00 BSC
0.65 BSC
0.025
0.021
0.65
MAX
1.00
0.05
0.25
0.30
2.55
1.85
0.50
−−−
SCALE 10:1
0.014
0.35
1.700
0.685
Exposed Pad
SMD Defined
NCP623/D
inches
mm