LP38500TS-ADJ/NOPB National Semiconductor, LP38500TS-ADJ/NOPB Datasheet - Page 12

• Manufacturer Part Number: LP38500TS-ADJ/NOPB
• Description: IC REG LDO 1.5A FLEXCAP TO263-5
• Manufacturer: National Semiconductor

Specifications of LP38500TS-ADJ/NOPB

• Regulator Topology: Positive Adjustable
• Voltage - Output: 0.6 ~ 5 V
• Voltage - Input: 2.7 ~ 5.5 V
• Voltage - Dropout (typical): 0.22V @ 1.5A
• Number Of Regulators: 1
• Current - Output: 1.5A
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: TO-263-5, D²Pak (5 leads + Tab), TO-263BA
• Number Of Outputs: 1
• Polarity: Positive
• Input Voltage Max: 5.5 V
• Output Voltage: 0.6 V to 5 V
• Output Type: Adjustable
• Dropout Voltage (max): 0.275 V At 1.5 A
• Output Current: 1.5 A
• Line Regulation: 0.04 %/V
• Load Regulation: 0.18 %/A
• Voltage Regulation Accuracy: +/- 3.5 %
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Limit (min): -
• Lead Free Status / Rohs Status: Details
• Other names: LP38500TS-ADJ

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The LP38500/2-ADJ is available in the TO-263 and LLP-8
packages. The thermal resistance depends on the amount of
copper area allocated to heat transfer.
HEATSINKING TO-263 and TO-263 THIN PACKAGES
The TO-263 package and TO-263 THIN package use the
copper plane on the PCB as a heatsink. The DAP of the pack-
age is soldered to the copper plane for heat sinking. Figure
5 shows a typical curve for the θ
different copper area sizes (the thermal performance of both
TO-263 and TO-263 THIN are the same). The tests were
done using a PCB with 1 ounce copper on top side only, with
copper patterns which were square in shape.
FIGURE 5. θ
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vs Copper Area for TO-263 Package
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of the TO-263 package for
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As shown in the figure, increasing the copper area beyond 1.5
square inch produces very little improvement.
HEATSINKING LLP-8 PACKAGE
The junction-to-ambient thermal resistance for the LLP-8
package is dependent on how much PCB copper is present
to conduct heat away from the device. The LP38502SD-ADJ
evaluation board (980600046-100) was tested and gave a
result of about 80°C/W with a power dissipation of 1W and no
external airflow. This evaluation board is a two layer board
using two ounce copper, and the copper area on topside for
heatsinking is approximately two square inches. Multiple vias
under the DAP also thermally connect to the backside layer
which has about three square inches of copper dedicated to
heatsinking.
Finite modeling of the LP38502SD-ADJ with a four layer
board (JEDEC JESD51-7 and JESD51-5) with one thermal
via directly under the DAP to the first copper plane predicts a
θ
With four thermal vias directly under the DAP to the first cop-
per plane, the modeling predicts a θ
Adding a dog-bone copper area with four additional thermal
vias in the dog-bone area to the first copper plane can improve
θ
See Application Note AN-1520 A Guide to Board Layout for
Best Thermal Resistance for Exposed Packages for addition-
al thermal considerations for printed circuit board layouts.
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of 72°C/W.
to 45C°C/W.
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of 50°C/W.