BD3574FP-E2 Rohm Semiconductor, BD3574FP-E2 Datasheet - Page 5

• Manufacturer Part Number: BD3574FP-E2
• Description: IC REG LDO 5V 500MA TO-252-3
• Manufacturer: Rohm Semiconductor

Specifications of BD3574FP-E2

• Regulator Topology: Positive Fixed
• Voltage - Output: 5V
• Voltage - Input: 5.5 ~ 36 V
• Voltage - Dropout (typical): 0.25V @ 200mA
• Number Of Regulators: 1
• Current - Output: 500mA (Max)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: TO-252-2, DPak (2 Leads + Tab), TO-252AA, SC-63
• Primary Input Voltage: 13.2V
• No. Of Outputs: 1
• Output Voltage: 5V
• Output Current: 500mA
• Voltage Regulator Case Style: TO-252
• No. Of Pins: 3
• Operating Temperature Range: -40°C To +125°C
• Svhc: No SVHC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Limit (min): -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

●Output Voltage Adjustment
●Setting of Heat
●Calculation example
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2.0
1.6
1.2
0.8
0.4
0
Refer to the heat mitigation characteristics illustrated in Figs. 23, 24 and 25 when using the IC in an environment where T
≧25℃. The characteristics of the IC are greatly influenced by the operating temperature. If the temperature is in excess of
the maximum junction temperature T
sufficient consideration to the heat of the IC in view of two points, i.e., the protection of the IC from instantaneous damage
and the maintenance of the reliability of the IC in long-time operation.
In order to protect the IC from thermal destruction, it is necessary to operate the IC not in excess of the maximum junction
temperature T
the IC within the power dissipation Pd. The following method is used to calculate the power consumption P
The load current I
The maximum load current I
Example: BD3571FP V
Make a thermal calculation in consideration of the above so that the whole operating temperature range will be within the
power dissipation.
The power consumption Pc of the IC in the event of shorting (i.e., if the V
the following equation.
0
Io≦
1.2 W
P
Power dissipation Pd≦P
I
I
Pc=V
O
O
C
≦
≦
=(V
25
AMBIENT TEMPERATURE: T
89mA
CC
CC
Pd-V
0.624-12×I
Vo
ADJ
IC mounted on a ROHM standard board
Substrate size: 70 mm  70 mm  1.6 mm
ja = 104.2 (°C/W)
×(I
-V
50
V
TO252-3
Fig.22
O
CC
12-5
jmax
CC
CC
Fig. 23
(I
)×I
R2
R1
-V
CC
+Ishort)
×I
75
O
. Fig. 23 illustrates the power dissipation/heat mitigation characteristics for the TO252 package. Operate
O
O
=30μA)
is obtained to operate the IC within the power dissipation.
CC
+V
CC
100
CC
CC
×I
= 12 V and V
a
C
[°C]
omax
CC
125
(For more information about I
for the applied voltage V
150
To set the output voltage insert pull-down resistor R1 between the ADJ and GND pins,
and pull-up resistor R2 between the V
The recommended connection resistor for the ADJ-GND is 30k～150kΩ.
Ishort = Short current
jmax
θ
25℃=1.2W→85℃=0.624W
O
ja
2.0
1.6
1.2
0.8
0.4
, the elements of the IC may be deteriorated or damaged. It is necessary to give
= 5 V at T
=104.2℃/W→-9.6mAW/℃
0
0
1.3W
Vo = VADJ×(R1+R2) / R1 [V]
25
AMBIENT TEMPERATURE: T
a
｛VADJ=1.26V(TYP.)｝
IC mounted on a ROHM standard board
Substrate size: 70 mm  70 mm  1.6 mm
ja = 96.2 (°C/W)
= 85℃
50
TO252-5
CC
5/9
Fig. 24
CC
can be calculated during the thermal design process.
75
, see page 12.)
100
a
[ ℃ ]
125
Vcc : Input voltage
Vo : Output voltage
Io : Load current
Icc : Total supply current
O
O
and GND pins are shorted) will be obtained from
and ADJ pins.
150
2.0
1.6
1.2
0.8
0.4
0
0
1.6 W
25
AMBIENT TEMPERATURE: T
IC mounted on a ROHM standard board
Substrate size: 70 mm  70 mm  1.6 mm
ja = 78.1 (°C/W)
50
HRP5
Fig. 25
Technical Note
2011.03 - Rev.B
75
C
(W).
100
a
[°C]
125
150
a